Micro LED Display Module Manufacturing via Merged Driver Chip Integration
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Solution Overview
Problem
The manufacturing process of micro LED display modules faces challenges with low product yield and high production costs due to the difficulty in transferring and wire bonding micro LEDs of different colors, which are typically produced in separate batches and attached to a control circuit board.
Innovation Solution
A method where micro LEDs are produced in an array form and disposed on a driver chip block with a light transmissive conductive layer serving as a common electrode, allowing each micro LED to be addressed individually for separate light emission, and a RGB color layer is added for full-color display, enabling easier transfer and higher resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If micro LEDs of different colors are manufactured in different batches and attached in batches to a control circuit board, then color accuracy and display quality are improved, but the difficulty of transfer and wire bonding increases, leading to low product yield and low production efficiency
Solution Approach 1:
The patent merges multiple micro LEDs of different colors onto a single driver chip block, allowing them to be transferred and wired together in one batch rather than separately. This combining approach maintains color accuracy while dramatically improving production efficiency and yield by reducing the complexity of handling multiple separate batches.
Solution Approach 2:
The driver chip block is designed to universally accommodate multiple micro LEDs of different colors on a single substrate. This multi-functional platform allows different colored micro LEDs to be integrated together, enabling batch processing for all colors simultaneously rather than requiring separate processing lines for each color.
2Manufacturing precision
If micro LEDs are miniaturized into the micrometer scale to achieve super high resolution, then display resolution is improved, but the difficulty of transfer and wire bonding increases, leading to low product yield
Solution Approach 1:
By combining multiple miniaturized micro LEDs onto a single driver chip block, the patent enables batch transfer and wire bonding processes. This approach maintains the high resolution benefits of miniaturized micro LEDs while improving product yield by allowing statistical process control and reducing the cumulative errors that would occur in individual handling of each micro LED.
3Manufacturing precision
If micro LEDs are manufactured and attached in separate batches for different colors, then color-specific optimization is improved, but the complexity of the manufacturing process increases, leading to high production cost
Solution Approach 1:
The patent combines multiple color-specific micro LED manufacturing processes into a single integrated batch process on a driver chip block. This merging reduces manufacturing process complexity by eliminating the need for multiple separate batch processes, while still maintaining color-specific optimization through dedicated regions on the same chip block.
Data Source
AI summary
A manufacturing method of micro LED display module is provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, and the color layer is disposed on the light transmissive conductive layer.