Micro LED Panel Edge Heat Dissipation Structure
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Solution Overview
Problem
Micro LED display panels face challenges with heat dissipation, which can impact their performance due to high temperatures generated during light emission.
Innovation Solution
The implementation of an integrated circuit backplane with a heat dissipation structure in contact with the micro LED array, utilizing materials like Cu, AlN, SiC, Boron Nitride, diamond, or diamond-like carbon, and enhanced structures such as hollow columns and thermal conductive adhesives to improve heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If micro LED array is provided on IC backplane for high performance display, then output performance and resolution are improved, but heat generation increases causing performance degradation
Solution Approach 1:
The patent extracts the heat dissipation function from the IC backplane structure by adding a dedicated heat dissipation structure that contacts the micro LED array. This separate heat dissipation component allows the display function to be optimized for high resolution while the thermal management is handled independently, resolving the contradiction between high performance and heat generation.
Solution Approach 2:
The heat dissipation structure serves as an intermediary between the micro LED array and the IC backplane. It mediates the thermal interaction by providing a dedicated thermal conduction path that contacts the edges of the micro LED array, allowing heat to be efficiently transferred away from the light-emitting components without interfering with the display performance.
2Temperature
If heat dissipation structure is added to improve thermal management, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The heat dissipation structure is designed with local quality by positioning it to contact specifically the edges of the micro LED array where heat generation is concentrated. The structure uses different materials with varying thermal conductivities at different locations - high thermal conductivity materials (Cu, AlN, SiC, diamond) in direct contact with the micro LED array, and other materials for the extending portions. This localized optimization achieves effective heat dissipation without requiring complex structures throughout the entire device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency, maintaining panel performance by effectively radiating heat generated by the micro LEDs, thereby improving thermal management.
Implementation Method 1
a heat dissipation structure provided on the IC backplane and in contact with edges of the micro LED array
Implementation Method 2
The heat dissipation structure may include a plurality of hollow columns extending from a top surface to a bottom surface
Data Source
AI summary
A micro LED display panel includes an integrated circuit (IC) backplane; a micro LED array provided on the IC backplane, the IC backplane controlling the micro LED array; and a heat dissipation structure provided on the IC backplane and in contact with edges of the micro LED array.