Elastic Bonding Electrode Structure for Micro LED Mass Transfer
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Solution Overview
Problem
The existing micro inorganic light-emitting diode technology faces challenges in mass transfer due to non-uniform flatness of the micro inorganic light-emitting diode chip carrier board and driver circuit substrate, leading to difficulties in bonding and increased transfer time.
Innovation Solution
A display substrate with an elastic layer sandwiched between the bonding electrode and insulation layer, which compensates for aligning and bonding pressure, and includes a material like photoresist or PDMS to ensure precise bonding and improved transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mass transfer technology is used to bind micro inorganic light-emitting diode chips with driver circuit substrate, then the chips can be connected to the driver circuit, but the non-uniform flatness of the carrier board and substrate causes bonding difficulties and increases transfer time
Solution Approach 1:
A transfer carrier board is introduced as an intermediary component between the micro inorganic light-emitting diode chips and the driver circuit substrate. The transfer carrier board includes a first substrate with bonding pads that temporarily hold the chips during transfer, facilitating precise positioning and bonding while compensating for flatness variations. This intermediary structure enables reliable mass transfer without direct contact between the chips and the final substrate, reducing transfer time and improving bonding reliability.
2Ease of manufacture
If the flatness of the carrier board and driver circuit substrate is improved to facilitate mass transfer, then bonding difficulty is reduced, but the complexity of the manufacturing process increases
Solution Approach 1:
The manufacturing process is segmented into distinct stages: chip mounting on the transfer carrier board, alignment with the driver circuit substrate, and bonding. The transfer carrier board is divided into a first substrate for chip mounting and a second substrate for receiving the chips. This segmentation allows each stage to be optimized independently, simplifying the overall manufacturing process while maintaining ease of mass transfer.
Solution Approach 2:
The micro inorganic light-emitting diode chips are preliminarily mounted and positioned on the transfer carrier board before the actual transfer to the driver circuit substrate. Alignment marks are pre-formed on both the transfer carrier board and the driver circuit substrate to facilitate precise positioning. This preliminary action ensures that the bonding process is simplified and reduces the complexity of the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The elastic layer reduces bonding difficulties caused by non-uniform flatness, allowing for precise bonding of micro inorganic light-emitting diode chips without reducing transfer area, thereby shortening transfer time and enhancing mass transfer efficiency.
Implementation Method 1
an elastic layer sandwiched between the bonding electrode and the insulation layer, the elastic layer having an orthographic projection on the substrate covering at least an orthographic projection of the bonding electrode on the substrate
Data Source
AI summary
The present disclosure discloses a display substrate, including a substrate, and a driver circuit, an insulation layer and a bonding electrode sequentially superposed on the substrate. The bonding electrode is configured to be connected to an anode and a cathode of a micro inorganic light-emitting diode chip to be bonded. The display substrate further includes an elastic layer sandwiched between the bonding electrode and the insulation layer, the elastic layer having an orthographic projection on the substrate covering at least an orthographic projection of the bonding electrode on the substrate. The present disclosure provides a display panel, including the above display substrate, and further including a micro inorganic light-emitting diode chip having an anode and a cathode thereof connected to the bonding electrode on the display substrate.