Micro LED Pixel Electrode Corrosion Protection

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Solution Overview

Problem

In micro LED display manufacturing, the metal electrode layer in the pixel electrode reacts with organic solvents or films, leading to residue and defects, necessitating a solution to prevent corrosion and ensure reliable bonding with the micro LED chip.

Innovation Solution

A metal protective layer is added to the non-soldering region of the metal electrode layer, using materials like molybdenum and titanium, which protects the electrode from corrosion while allowing soldering in the soldering region without affecting subsequent processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a metal electrode layer is used in the pixel electrode, then good electrical conductivity and soldering performance are achieved, but the metal electrode layer reacts with organic solvents or films in subsequent processes causing residue and defects

Engineering Contradiction:

Improvebonding reliabilityVSAvoidcorrosion and residue

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

An organic protective layer is introduced as an intermediary between the metal electrode layer and the subsequent organic processes. This protective layer prevents direct contact and reaction between the metal electrode and organic solvents or films, eliminating corrosion and residue issues while allowing the metal electrode to maintain its soldering functionality.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The organic protective layer is applied in advance before subsequent organic processes. This preliminary protective action prevents the harmful reaction between the metal electrode layer and organic materials from occurring, thereby preventing corrosion and residue formation before they can happen.

Inventive Principle:

Principle #9Preliminary anti-action

2Object-affected harmful factors

If the metal electrode layer is protected in the non-soldering region, then corrosion is prevented, but the soldering process may be affected

Engineering Contradiction:

Improvecorrosion preventionVSAvoidsoldering process

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The organic protective layer is selectively applied only to the non-soldering region of the metal electrode layer, leaving the soldering region exposed. This local protection approach prevents corrosion in areas where it is needed while maintaining full soldering accessibility in areas where bonding is required.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS11302681B2Display device and method of manufacturing thereof

Publication Date: 2022.04.12 SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD

AI summary

A display device and a method of manufacturing thereof are provided. A display device includes an array substrate and a pixel electrode disposed on the array substrate. The pixel electrode includes a soldering region, a non-soldering region, a transparent conductive oxide layer formed on the array substrate, a first metal electrode layer disposed on the transparent conductive oxide layer of the soldering region and the non-soldering region, a second metal protective layer disposed on the first metal electrode layer of the non-soldering region, and a micro LED chip including a pin correspondingly soldered on the first metal electrode layer of the soldering region. The metal electrode layer easily reacted with the organic solvent or the organic film to cause residue or defects can be improved, and the first metal electrode layer is merely retained to provide a solder joint for soldering the micro LED chip without affecting subsequent processes.