Micro-LED Display Element Structure for Electrode Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Miniaturization of light-emitting diodes (LEDs) leads to close proximity of P and N electrodes, causing short-circuit issues and limiting resolution improvement, while vertical micro-LEDs have inefficient light emission and debugging challenges due to incomplete testing of LED components.
Innovation Solution
A display element design featuring spacers, electrodes, a reflective layer, and transparent conductive layers that concentrate light emission upward and allow individual LED structures to be tested before bonding, comprising a first spacer, second spacer, first electrode, second electrode, LED structure with semiconductor layers, reflective layer, first transparent molding layer, and transparent conductive layer, with optional light-absorbing and light-reflective structures to enhance light emission and debugging efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the unit area of light-emitting elements is reduced to increase resolution, then the resolution is improved, but the P electrode and N electrode become too close causing short-circuit problems
Solution Approach 1:
The patent transitions from a planar electrode arrangement to a three-dimensional vertical structure. The P electrode and N electrode are positioned on opposite sides of the LED component in the vertical dimension, with spacers providing lateral separation. This dimensional change allows electrodes to be physically isolated while maintaining compact footprint, thus improving resolution without increasing short-circuit risk.
2Reliability
If a vertical micro-LED structure is used to separate electrodes vertically, then short-circuit problems are avoided, but light emission efficiency deteriorates because only upward emitted light is effective
Solution Approach 1:
The patent applies different structural characteristics to different regions of the device. The sidewalls of the LED component are engineered with specific geometries (stepped surfaces or concave surfaces at 30-55 degrees) to locally control light reflection and extraction. This local structural optimization enhances light emission efficiency in the vertical direction while maintaining electrode separation.
3Ease of manufacture
If existing LED component processes are used, then manufacturing is simpler, but debugging becomes difficult because individual LED components cannot be tested at completion
Solution Approach 1:
The patent incorporates test electrodes and testing interfaces into the LED component structure before final assembly. The transparent conductive layer extends to the second electrode, creating accessible testing points that allow individual LED components to be electrically tested at completion. This preliminary inclusion of testing capability enables debugging before the components are bonded into the final display, improving defect detection without significantly complicating manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances light-emitting efficiency by concentrating light emission and allows for individual LED testing, improving debugging efficiency by forming a complete circuit during manufacturing.
Implementation Method 1
The reflective layer is located on a sidewall of the first spacer facing the LED structure
Data Source
AI summary
A display element includes a first spacer, a second spacer, at least one first electrode, a second electrode, at least one LED structure, a reflective layer, a first transparent molding layer and a transparent conductive layer. The second spacer is located on one side of the first spacer. The first electrode is surrounded by the first spacer. The second electrode is surrounded by the second spacer. The LED structure is located on the first electrode. The reflective layer is located on a sidewall of the first spacer facing the LED structure. The first transparent molding layer is located on the reflective layer and surrounds the LED structure. The transparent conductive layer is located on the top surface of the second semiconductor layer and the top surface of the first transparent molding layer, and extends to the second electrode.


