Micro LED Matrix Substrate Low Reflectivity Electrode Junctions
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Solution Overview
Problem
The manufacturing process of micro LED array displays is complex and costly due to the high accuracy and small size of micro LEDs, leading to increased time and expense compared to conventional LED displays.
Innovation Solution
A simplified manufacturing method for optoelectronic semiconductor devices using microsized elements, involving steps like electrode alignment, lamination, coupling, illumination, and lift-off, which eliminates the need for transferring individual LEDs to other substrates, reducing the process complexity and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional LED manufacturing procedures are used with microsized elements, then individual LEDs can be obtained, but the manufacturing process becomes complex and costly with increased time and expense
Solution Approach 1:
The patent combines multiple separate manufacturing steps (epitaxial growth, half-cutting for electrical insulation, probing, full cutting, and transfer operations) into a single integrated process where micro LEDs are grown directly on the final substrate in their definitive positions. This eliminates the need for sequential processing and transfer operations, reducing overall process complexity while maintaining precise micro LED dimensions.
Solution Approach 2:
The patent performs preliminary actions by pre-forming the complete device structure directly on the final substrate before any separation or transfer operations would be needed. The micro LEDs are epitaxially grown with their electrodes and electrical insulation already in place, eliminating subsequent complex manipulation steps.
2Manufacturing precision
If conventional LED manufacturing procedures are used with microsized elements, then individual LEDs can be obtained, but the manufacturing time increases
Solution Approach 1:
The patent merges multiple time-consuming sequential operations into a single parallel epitaxial growth process. All micro LEDs are formed simultaneously on the substrate in their final positions, eliminating the time required for sequential transfer and assembly operations while maintaining precise dimensional control.
Solution Approach 2:
The patent maintains continuous useful action throughout the manufacturing process by performing all formation steps (epitaxial growth, electrode formation, insulation creation) in an uninterrupted sequence directly on the final substrate, eliminating idle transfer and repositioning time between operations.
3Manufacturing precision
If conventional LED manufacturing procedures are used with microsized elements, then individual LEDs can be obtained, but the cost increases
Solution Approach 1:
The patent combines multiple expensive specialized processing steps into a single epitaxial growth operation that forms the complete micro LED structure in one process. This eliminates the need for multiple equipment setups, transfer operations, and intermediate handling, significantly reducing manufacturing costs while maintaining precise micro LED dimensions.
Solution Approach 2:
The patent extracts and eliminates unnecessary intermediate steps (transfer to carrying substrate, pick-up operations, repositioning) from the manufacturing流程, keeping only the essential epitaxial growth and formation steps that directly create the functional device, thereby reducing overall manufacturing cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method results in a faster and less costly production of optoelectronic semiconductor devices with higher resolution capabilities, suitable for applications like VR and AR head-mounted displays, by directly integrating microsized elements onto a matrix substrate without the need for extensive epitaxial and photolithography processes.
Implementation Method 1
a first light is provided to concentratedly illuminate at least some of junctions between the first electrodes and the third electrodes or concentratedly illuminate at least some of junctions between the second electrodes and the fourth electrodes
Implementation Method 2
a second light is provided to concentratedly illuminate at least some of interfaces between the microsized optoelectronic semiconductor elements and the epitaxial substrate to peel off the microsized optoelectronic semiconductor elements from the epitaxial substrate
Data Source
AI summary
An optoelectronic semiconductor device is disclosed. The optoelectronic semiconductor device includes a matrix substrate including a matrix circuit and a substrate, and a plurality of microsized optoelectronic semiconductor elements disposed separately and disposed on the matrix circuit. Each of the microsized optoelectronic semiconductor elements includes a first electrode and a second electrode, the matrix circuit includes a plurality of third electrodes and a plurality of fourth electrodes. The first electrodes are coupled with and electrically connected with the third electrodes respectively, or the second electrodes are coupled with and electrically connected with the fourth electrodes respectively. Reflectivities of at least some of junctions between the first electrode and the third electrode, or reflectivities of at least some of junctions between the second electrode and the fourth electrode are less than 20%.