Micro-LED Chip Layout With Extended Emission Layer Isolation
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Solution Overview
Problem
Existing micro-LED structures face challenges in enhancing light emission efficiency due to surface recombination carrier loss at the edges of the light emitting layer contacting the conductive layers.
Innovation Solution
A micro-LED structure is designed with a light emitting layer that extends horizontally away from the edges of the first and second conductive layers, preventing edge contact and reducing surface recombination, while also incorporating a metal layer on the light emitting layer between adjacent micro-LEDs for improved isolation and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the light emitting layer contacts the edges of the conductive layers, then the device structure is simpler and easier to manufacture, but surface recombination carrier loss increases and light emission efficiency decreases
Solution Approach 1:
An isolation layer is introduced as an intermediary component between the light emitting layer and the conductive layers. This isolation layer prevents direct contact at the edges, thereby reducing surface recombination carrier loss while maintaining manufacturing feasibility. The isolation layer acts as a mediator that resolves the conflict between structural simplicity and energy efficiency.
2Loss of energy
If the light emitting layer extends horizontally away from the conductive layer edges, then light emission efficiency is improved by reducing surface recombination, but device structure becomes more complex
Solution Approach 1:
The isolation layer serves as a mediator that enables the light emitting layer to extend horizontally away from the conductive layer edges without creating direct contact. This achieves the goal of reducing surface recombination and improving light emission efficiency while the isolation layer manages the structural complexity by providing a clear separation interface.
3Productivity
If adjacent micro-LEDs are placed close together to increase chip density, then chip productivity is improved, but carrier injection efficiency decreases due to interference between adjacent devices
Solution Approach 1:
The isolation layer segments the active regions of adjacent micro-LEDs, creating electrical and optical separation between them. This segmentation allows higher chip density by enabling closer placement of micro-LEDs while preventing interference between adjacent devices, thereby maintaining carrier injection efficiency despite increased density.
Solution Approach 2:
The isolation layer acts as an intermediary barrier between adjacent micro-LEDs, preventing carrier and light interference while allowing the micro-LEDs to be positioned closely together. This mediator enables high chip density without sacrificing the reliability of carrier injection in each individual micro-LED.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances light emission efficiency by minimizing surface recombination and improving carrier injection efficiency, while the metal layer aids in isolating adjacent micro-LEDs, thereby optimizing the performance of the micro-LED chip.
Implementation Method 1
A micro-light emitting diode (micro-LED) is a device that emits light using an electric signal
Data Source
AI summary
A micro-LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer extends along a horizontal level from a top edge of the first type conductive layer and a bottom edge of the second type conductive layer. The micro-LED chip further includes a metal layer formed on a portion of the light emitting layer that extends from the second type conductive layer.