Micro-LED Substrate Encapsulation With Frame Glue Sealing
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Solution Overview
Problem
Traditional micro-LED display encapsulation methods face challenges with low position accuracy of LED chips, conductivity issues, and poor uniformity of encapsulating glue, leading to poor water and oxygen resistance, low light transmittance, and display uniformity.
Innovation Solution
A substrate encapsulating method involving a combination of switching and light-emitting substrates bonded with frame glue, using underlays with high hardness and uniform thickness to seal light-emitting diodes within a vacuum cavity, improving encapsulation and reducing the issues associated with silicone films.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If encapsulant such as silicone is used to coat the entire surface of the LED chip, then encapsulation is achieved, but the LED chip may move causing low position accuracy and affecting conductivity
Solution Approach 1:
The patent divides the encapsulation structure into two parts: frame glue at the edges providing mechanical support and fixation, and optical glue filling the interior providing optical coupling. This segmentation prevents LED chip movement through the frame glue's structural support while maintaining positioning accuracy
Solution Approach 2:
The patent transitions from traditional full-surface 2D encapsulation to a 3D structured encapsulation with frame glue forming a peripheral boundary structure. This dimensional change creates a physical constraint that prevents LED chip displacement while maintaining precise positioning
2Reliability
If encapsulant such as silicone is used to coat the entire surface of the LED chip, then encapsulation is achieved, but thickness uniformity is difficult to control resulting in poor water and oxygen resistance
Solution Approach 1:
The patent segments the encapsulation function between frame glue (providing structural seal at edges) and optical glue (filling interior space). This segmentation allows the frame glue to ensure uniform thickness for the seal while the optical glue fills the remaining space, solving the thickness uniformity problem for water and oxygen resistance
Solution Approach 2:
The patent applies different glue materials with different properties to different locations: frame glue with appropriate viscosity and curing characteristics at the edges for sealing, and optical glue with optimized optical properties in the interior. This local quality differentiation ensures both uniform thickness for sealing and optimal optical performance
3Reliability
If encapsulant such as silicone is used to coat the entire surface of the LED chip, then encapsulation is achieved, but light transmittance is low affecting display uniformity
Solution Approach 1:
The patent segments the encapsulation materials by function: frame glue provides structural encapsulation and sealing at the periphery, while optical glue provides optical coupling and light transmission in the interior. This segmentation allows optimization of each material for its specific function, improving overall light transmittance and display uniformity while maintaining encapsulation effectiveness
Solution Approach 2:
The patent applies optical glue with optimized optical properties (high transmittance, appropriate refractive index) in the light path area, while frame glue provides structural support at the edges. This local quality optimization ensures high light transmittance in the display area while maintaining effective encapsulation at the boundaries
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances display uniformity, increases light output efficiency, and reduces power consumption by improving water and oxygen resistance and light transmittance.
Implementation Method 1
evacuating the switching substrate and the light-emitting substrate using a vacuum device
Implementation Method 2
bonding the light-emitting diode to the second underlay using an optical glue; and baking the light-emitting substrate at a high temperature to cure a layer of the optical glue
Data Source
AI summary
The present application provides a substrate encapsulating method, a display panel, and a display device. The substrate encapsulating method includes providing a first underlay, and fabricating a switching device on the first underlay to form a switching substrate; providing a second underlay, and fabricating a light-emitting diode on the second underlay to form a light-emitting substrate; applying a frame glue to an edge of the switching substrate or an edge of the light-emitting substrate; and bonding the switching substrate and the light-emitting substrate with the frame glue to seal the light-emitting diode between the switching substrate and the light-emitting substrate.