Micro LED Transfer Substrate with Funnel Alignment Structure

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Solution Overview

Problem

The challenge in micro LED display technology is the alignment deviation of micro LED chips during transfer to a driving backplane, leading to potential transfer failure due to deformation of the adhesive layer and misalignment of electrodes.

Innovation Solution

A driving substrate with a binding metal layer and a positioning layer having a width gradient is used, along with micro LED electrodes designed with tapered ends, to facilitate accurate alignment through a micro LED transfer device and method, utilizing a positioning layer with a slope or recessed surface to guide electrodes onto the binding metal layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If massive transfer technology is used to transfer micro LED chips from growth substrate to driving backplane, then transfer efficiency is improved, but position alignment accuracy deteriorates due to adhesive layer deformation and misalignment between transfer substrate and backplane circuit

Engineering Contradiction:
Improvetransfer efficiencyVSAvoidposition alignment accuracy
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

A positioning layer is introduced as an intermediary component between the binding metal layer and the adhesive layer. This positioning layer features a funnel-shaped groove structure that acts as a mediator to guide and align the tapered electrodes with the binding metal layer, resolving the alignment inaccuracy problem while maintaining the massive transfer process

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The positioning layer adds a vertical dimension solution by creating a funnel-shaped groove that extends from the adhesive layer surface down to the binding metal layer. This three-dimensional structure provides alignment guidance in the vertical direction, compensating for horizontal misalignment issues during the transfer process

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Measurement precision

If high resolution display is implemented with small alignment area, then display quality is improved, but alignment difficulty increases making electrode-to-position alignment more challenging

Engineering Contradiction:
Improvedisplay resolutionVSAvoidalignment difficulty
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The positioning layer serves as a mediator that simplifies the alignment process for high-resolution displays. The funnel-shaped groove structure provides automatic alignment guidance, reducing the complexity of aligning tiny electrodes with precise positioning requirements in high-resolution displays

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS12604567B2Driving substrate, micro LED transfer device and micro LED transfer method
Publication Date: 2026.04.14 HKC CORP LTD
  • US12604567B2 patent drawing
  • US12604567B2 patent drawing
  • US12604567B2 patent drawing

AI summary

A driving substrate, a micro LED transfer device and a micro LED transfer method are provided. A side surface of the driving substrate is arranged with a binding metal layer, a positioning layer is arranged around the binding metal layer, and a width of the positioning layer at a position away from the driving substrate is less than that a width at a position close to the driving substrate.