Micro LED Display Module Grounding and Side Molding for ESD Rigidity
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Solution Overview
Problem
Current display technologies, such as liquid crystal panels and OLED panels, face issues like slow response time, high power consumption, and vulnerability to burn-in, while micro LED panels using inorganic light-emitting devices offer improved brightness, resolution, and durability but require enhanced structural reliability and ESD protection.
Innovation Solution
A display device and manufacturing method featuring a substrate with mounted inorganic light-emitting devices, a metal plate, side molding, and a grounding member, along with a front cover and anisotropic conductive layer, to ensure ESD protection and rigidity against external forces, allowing for scalable and reliable display module assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If micro LED panels use inorganic light-emitting devices mounted on substrates, then brightness, resolution, and durability are improved, but structural reliability and ESD protection require enhancement
Solution Approach 1:
The display device is divided into modular components including substrate, front cover, side molding, and grounding member. Each component performs specific functions and can be manufactured separately then assembled, allowing complexity to be managed through modular design while achieving comprehensive ESD protection and structural reliability
Solution Approach 2:
The side molding serves multiple functions: it provides structural support, enables ESD protection through grounding member integration, and contributes to the overall rigidity of the display device. This multi-functionality reduces the need for additional separate components, managing device complexity while enhancing reliability
2Area of stationary object
If display modules are enlarged for large-screen displays, then screen size is increased, but rigidity against external forces may be compromised
Solution Approach 1:
The display device combines different materials with complementary properties: the substrate provides a rigid foundation, the front cover offers protective rigidity, and the side molding adds structural reinforcement. This composite structure maintains high rigidity even in large-screen configurations by distributing mechanical loads across multiple material components
Solution Approach 2:
The side molding features curved surfaces that provide structural reinforcement similar to arches in architecture. These curved geometries efficiently distribute external forces across the structure, maintaining rigidity in enlarged display modules without requiring excessive material thickness
3Reliability
If inorganic light-emitting devices are mounted on substrates, then burn-in phenomenon is eliminated, but ESD protection mechanisms are required
Solution Approach 1:
The grounding member acts as an intermediary that provides a safe path for electrostatic discharge. It connects the substrate to external ground, allowing static electricity to dissipate harmlessly rather than damaging the sensitive inorganic light-emitting devices. This mediator approach protects against ESD while preserving the burn-in resistance benefits of inorganic LEDs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced reliability against Electrostatic Discharge (ESD) and structural rigidity, enabling the creation of large, high-resolution displays with improved durability and reduced visibility of seams between modules.
Implementation Method 1
a grounding member grounded to the metal plate and adhered to a lower surface of the side molding
Implementation Method 2
an anisotropic conductive layer positioned on an upper surface of the TFT layer and configured to electrically connect the TFT layer to the plurality of inorganic light-emitting devices
Implementation Method 3
a plurality of inorganic light-emitting devices are mounted on a substrate
Implementation Method 4
self-emissive inorganic light-emitting devices
Implementation Method 5
the side molding is injection-molded on the side surface of the substrate and is in contact with the side surface
Data Source
AI summary
A display module includes a substrate including a mounting surface on which a plurality of inorganic light-emitting devices are mounted, a side surface, and a rear surface opposite to the mounting surface; a front cover covering the mounting surface and extending to an outer area from the mounting surface; a metal plate positioned on the rear surface of the substrate; a side molding covering the side surface and positioned below the outer area from the mounting surface; and a grounding member grounded to the metal plate and adhered to a lower surface of the side molding, where the side molding is injection-molded on the side surface of the substrate and is in contact with the side surface.