Micro LED Group Remapping Across Carrier Pitches for Uniform Emission
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Micro LED dies in displays exhibit noticeable deviations in emission wavelength, luminous intensity, and chromaticity, leading to non-uniform distributions and fading areas on conventional displays.
Innovation Solution
A method involving categorization and transfer of LED groups with specific emission properties onto substrates and carriers, using predetermined patterns to mix and pitch LED dies, ensuring uniform distribution and optimal placement on displays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If LED dies are arranged on conventional displays without mixing, then the manufacturing process is simple, but noticeable deviations in emission wavelength, luminous intensity, and chromaticity cause non-uniform distribution and fading areas
Solution Approach 1:
The patent segments LED dies into different categories based on their emission properties (wavelength, luminous intensity, chromaticity). By dividing the LED population into discrete groups with similar characteristics, the system can systematically mix and match these segments to achieve uniform overall distribution, resolving the non-uniformity issue caused by compositional deviations in individual LED dies.
Solution Approach 2:
The patent introduces a new dimension of mixing by transferring LED dies between different substrates and carriers before final assembly. This intermediate mixing stage adds a spatial dimension to the distribution control, allowing LED dies from different categorical groups to be redistributed across the display surface, thereby achieving uniformity without complicating the core LED manufacturing process.
2Manufacturing precision
If LED dies with various emission properties are mixed, then uniform distribution on display is achieved, but the processing method becomes complex with multiple transfer stages
Solution Approach 1:
The patent performs preliminary categorization and mixing of LED dies on intermediate substrates before final transfer to the display. By pre-sorting LED dies into categories based on their emission properties and pre-mixing them on carrier substrates, the system establishes uniform distribution early in the process, which simplifies subsequent assembly steps and maintains high productivity despite the added mixing complexity.
Solution Approach 2:
The patent introduces intermediate substrates and carriers as mediators in the LED transfer process. These intermediary elements serve as temporary holding and mixing platforms, allowing LED dies to be redistributed according to their emission properties without requiring direct complex coordination between the LED source and final display assembly, thereby maintaining processing efficiency.
3Manufacturing precision
If multiple transfer stages are used for mixing LED dies, then fading areas and facula are reduced, but the processing time and complexity increase
Solution Approach 1:
The patent segments the transfer process into distinct stages, each handling specific categories of LED dies. By dividing the overall transfer operation into manageable segments (initial transfer to substrate, mixing on carrier, final transfer to display), the system can optimize each segment independently, reducing total processing time while achieving the uniformity needed to eliminate fading areas and facula.
Solution Approach 2:
The patent performs preliminary mixing and categorization of LED dies on intermediate carriers before final display assembly. By preparing the mixed LED distributions in advance on carrier substrates, the system reduces the complexity and time of the final transfer step, as the mixing work has already been completed during the intermediate processing stages.
Data Source
AI summary
A method of processing light-emitting elements includes: transferring a plurality of light-emitting elements from original wafers or next-stage carriers, based on a predetermined pattern. The predetermined pattern arranges two adjacent LED groups in a first direction on the original wafer or carriers to be placed on two non-adjacent positions in the first direction on the next-stage carriers. The light-emitting elements on the original wafer have a horizontal wafer pitch and a vertical wafer pitch. The light-emitting elements on each of the next-stage carriers have a first horizontal pitch and a first vertical pitch. The first horizontal pitch is greater than the horizontal wafer pitch, or the first vertical pitch is greater than the vertical wafer pitch. Besides, a light-emitting element device using the aforementioned method is also provided.