Micro LED Holding Structure Edge Contact Transfer
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Solution Overview
Problem
The existing methods for transferring micro light-emitting diodes (LEDs) from a carrier to a receiving substrate often face challenges due to the size and shape of the contact surface between holding structures and the LEDs, affecting the transportation and transfer yield.
Innovation Solution
A micro device structure with a holding structure that includes connecting and holding portions, where the connecting portion is disposed on the edge of the micro device's top surface and the holding portion extends onto the substrate, optimizing the ratio of the holding structure's projection area to the micro device's surface area to enhance pick-up and transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If the holding structure contacts the micro LED at a larger area, then the holding force increases and the micro LED is more securely held, but the risk of damaging the micro LED increases and the transfer yield decreases
Solution Approach 1:
The holding structure is divided into multiple holding portions that contact different regions of the micro LED. This segmentation allows the holding force to be distributed across multiple points, preventing concentration of stress at any single location and reducing the risk of damage while maintaining secure holding.
Solution Approach 2:
The holding structure features varying contact areas and geometries at different locations. Some holding portions have larger contact areas for stable holding, while others have smaller contact areas to minimize stress concentration. This local variation in quality optimizes both holding force and damage prevention.
2Manufacturing precision
If the holding structure is designed with complex geometry to improve holding precision, then the transfer accuracy increases, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The holding structure incorporates flexible or adjustable components that can adapt to the micro LED's position and orientation. This dynamic capability allows the structure to achieve high transfer accuracy without requiring extremely precise static geometry, thereby reducing manufacturing complexity.
Solution Approach 2:
The holding structure is designed to perform multiple functions: holding the micro LED, positioning it accurately, and facilitating its release. By integrating these functions into a single structure with moderate complexity, the design avoids the need for multiple separate components, reducing overall system complexity while maintaining precision.
3Strength
If the holding structure uses stronger materials to prevent micro LED damage, then the structural strength increases, but the holding structure may exert excessive force and damage the micro LED
Solution Approach 1:
The holding structure uses materials with optimized mechanical properties, including appropriate elasticity and hardness. By carefully selecting and tuning these material parameters, the structure maintains sufficient strength for handling while being compliant enough to avoid excessive force that could damage the micro LED.
Solution Approach 2:
The holding structure incorporates cushioning elements or compliant features that absorb excess force before it reaches the micro LED. This pre-cushioning mechanism prevents damage by dissipating energy that would otherwise be transmitted to the delicate micro LED during picking, holding, and placement operations.
Data Source
AI summary
An apparatus with micro devices includes a circuit substrate, at least one micro device, and at least one light guide structure. The micro device is disposed on the circuit substrate. The micro device has a top surface and a bottom surface opposite to each other, a peripheral surface connected with the top surface and the bottom surface, a first-type electrode, and a second-type electrode. The light guide structure is disposed on the circuit substrate and is not in direct contact with the first-type electrode and the second-type electrode. The light guide structure includes at least one connecting portion and at least one holding portion. The connecting portion is disposed on an edge of the top surface of the micro device. An orthographic projection area of the light guide structure on the top surface is smaller than an area of the top surface.