Micro LED Chip Structure With Integrated Drive Transistor for Uniform Emission
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Solution Overview
Problem
The challenge in realizing high-resolution Micro LED display devices lies in the difficulty of transferring multiple Micro LEDs to a glass substrate while maintaining uniform light emission, due to the threshold voltage offset of driving transistors, which requires complex compensation circuits and limits the efficiency of large-scale Micro LED display production.
Innovation Solution
A chip structure is developed that integrates a micro light-emitting diode and a drive transistor on a substrate, where the drive transistor's first pole is coupled to the micro light-emitting diode's electrode, allowing for a compact driving circuit that does not occupy array substrate space, enabling efficient transfer and integration of multiple chip structures onto an array substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If complex compensation circuits are used to address threshold voltage offset, then uniform light emission is improved, but device complexity increases
Solution Approach 1:
The drive transistor is integrated directly into the chip structure with the micro light-emitting diode, merging the driving circuit functionality into the chip itself. This eliminates the need for separate compensation circuits on the array substrate, reducing overall device complexity while maintaining uniform light emission through the transistor's inherent threshold voltage characteristics
Solution Approach 2:
The drive transistor within the chip structure serves its own driving function, with the transistor's threshold voltage characteristics naturally providing the compensation needed for uniform light emission. The chip is self-sufficient in terms of driving control, eliminating the need for external compensation mechanisms
2Productivity
If driving circuits are placed on array substrate, then Micro LED transfer efficiency is improved, but the number of driving circuits is limited by substrate space
Solution Approach 1:
The driving circuit is merged into the chip structure itself, with the drive transistor fabricated on the same substrate as the micro light-emitting diode. This integration allows multiple chip structures to be transferred as unified units, increasing the number of driving circuits that can be implemented without being constrained by array substrate space
Solution Approach 2:
The driving circuit functionality is moved from the two-dimensional array substrate plane to the vertical integration within the chip structure. By stacking the drive transistor and micro LED in the same chip footprint, the system achieves three-dimensional utilization of space, enabling higher density of driving circuits
Data Source
AI summary
A chip structure, a manufacturing method thereof, and a display device are provided. The chip structure comprises a substrate, a micro light-emitting diode and a drive transistor arranged on the substrate, wherein a first pole of the drive transistor is coupled to a first electrode of the micro light-emitting diode.