Micro LED Light-Blocking Structure for Lithography Damage Prevention
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Solution Overview
Problem
Conventional micro light emitting diode (LED) manufacturing processes face challenges such as damage to micro LEDs during lithography for light blocking structure fabrication, poor development and peeling efficiency, leading to reduced structural reliability and low yield.
Innovation Solution
A micro light emitting diode structure is developed with a temporary substrate, where micro LEDs and light blocking structures with a light blocking layer and a light shielding layer are alternately arranged and fixed using a connection layer. The light blocking layer has a higher reflectivity and Young's modulus than the connection layer, ensuring structural integrity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the light blocking structure is manufactured after the micro light emitting diode is transferred onto the temporary substrate using lithography processes, then the light blocking structure can be formed, but the micro light emitting diode may be damaged easily during exposure, development, and etching
Solution Approach 1:
The light blocking structure is manufactured on a separate substrate before the micro LED transfer. This preliminary fabrication avoids exposing the transferred micro LED to lithography processes, eliminating damage risks while maintaining the ability to form precise light blocking patterns through pre-transfer processing
Solution Approach 2:
A separate substrate acts as an intermediary carrier for fabricating the light blocking structure. This intermediate substrate allows independent manufacturing of the light blocking pattern without interfering with the micro LED, and subsequent alignment and transfer processes integrate the two components without direct lithography exposure of the LED
2Ease of manufacture
If the light blocking structure is manufactured on the temporary substrate, then the structure can be integrated, but the efficiency of development and peeling may be poor
Solution Approach 1:
The device is segmented into separately manufactured components: the micro LED structure on its substrate and the light blocking structure on a different substrate. This segmentation allows independent optimization of each component's manufacturing process, enabling efficient development and peeling on各自的 substrates before final integration
Solution Approach 2:
The manufacturing process transitions from a single-substrate approach to a multi-substrate dimensional approach. By fabricating light blocking structures on a separate substrate plane, the process enables parallel manufacturing and independent optimization of development/peeling operations, improving overall efficiency before final three-dimensional integration
3Productivity
If conventional manufacturing processes are used, then the process can be completed, but the yield is low due to poor structural reliability
Solution Approach 1:
The light blocking structure is preliminarily fabricated on a separate substrate before micro LED transfer, avoiding lithography-induced damage to the LED. This preliminary separation maintains high structural reliability while enabling efficient subsequent integration, thereby improving overall production yield
Solution Approach 2:
A separate substrate serves as an intermediary for light blocking structure fabrication, decoupling the manufacturing processes. This intermediary approach preserves micro LED integrity during light blocking formation, ensuring high structural reliability and improved yield through reduced damage and enhanced process efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the structural reliability and production yield of micro LED structures by protecting the micro LEDs during light blocking structure fabrication and improving the bonding process, ultimately leading to better display performance.
Implementation Method 1
A reflectivity of the light blocking layer is greater than a reflectivity of the connection layer
Data Source
AI summary
A micro light emitting diode structure includes a temporary substrate, a plurality of micro light emitting elements, a plurality of light blocking structures, and a connection layer. The micro light emitting elements and the light blocking structures are disposed on the temporary substrate and arranged alternately. Each of the light blocking structures includes a light blocking layer, and a light shielding layer disposed thereon. The micro light emitting elements and the light blocking structures are fixed to the temporary substrate by the connection layer. The connection layer is a part of a plurality of fixing structures. A reflectivity of the light blocking layer is greater than a reflectivity of the connection layer, and a Young's modulus of the light blocking layer is greater than a Young's modulus of the fixing structures, and the Young's modulus of the fixing structures is greater than a Young's modulus of the light shielding layer.