Micro-LED Alignment via Magnetic Attraction and Segmentation
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Solution Overview
Problem
The challenge in micro-LED display fabrication lies in achieving fast and accurate alignment of light emitting diodes with different colors for color or full-color displays, as existing methods are inefficient and prone to errors during packaging.
Innovation Solution
A semiconductor light emitting device is fabricated using a substrate with semiconductor light emitting units of different colors, connected through electrodes and a conductive layer, and non-conductive walls are used to isolate and guide these units into precise positions, either through gravity or magnetic attraction during the packaging process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple light emitting diodes are arranged on a circuit board to achieve color display, then the display capability is improved, but the alignment accuracy and packaging efficiency deteriorate due to the complexity of handling different colored LEDs
Solution Approach 1:
The patent segments the light emitting diodes into different color groups (first colored LEDs and second colored LEDs) and processes them separately on different carrier substrates before final assembly. This segmentation allows each color group to be handled and aligned independently, improving overall alignment accuracy while maintaining full-color display capability.
Solution Approach 2:
The patent performs preliminary alignment and bonding operations on carrier substrates before final mounting on the circuit board. The LEDs are pre-aligned with their corresponding electrode pads on the carrier substrates, and this pre-aligned structure is then transferred to the final circuit board, ensuring high alignment accuracy throughout the process.
2Ease of manufacture
If traditional packaging methods are used for micro-LED displays, then the process is simple, but the packaging speed is slow and alignment is inaccurate
Solution Approach 1:
The patent merges multiple operations into a single integrated process: LED mounting, alignment, and electrical connection are combined into one bonding step where LEDs are directly bonded to their corresponding electrode pads on the circuit board. This eliminates separate alignment and connection steps, dramatically increasing packaging speed while maintaining simplicity.
Solution Approach 2:
The patent employs a self-aligning mechanism where the LED structure on the carrier substrate is designed to automatically align with the electrode pads on the circuit board during the bonding process. This self-service alignment reduces the need for complex external alignment equipment and procedures, improving both speed and simplicity.
3Speed
If light emitting diodes are dissociated from carrier board and fallen into alignment positions, then the alignment speed is improved, but the control precision may be affected by gravitational settling
Solution Approach 1:
The patent introduces a magnetic field as an intermediary force to control the positioning of LEDs. Magnets are placed on the circuit board to generate magnetic fields that guide and hold the LEDs (which contain magnetic particles) in their correct positions during the bonding process. This intermediary magnetic field provides both speed and precision, eliminating the imprecision of pure gravitational settling.
Solution Approach 2:
The patent changes the physical parameters of the LEDs by incorporating magnetic particles into their structure. This parameter change allows the LEDs to respond to magnetic fields for precise positioning, transforming them from passive components that only respond to gravity into active components that can be precisely controlled by magnetic forces during the alignment process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables quick and accurate packaging of micro-LED displays by ensuring precise alignment and electrical connectivity of light emitting diodes, enhancing the reliability and lifespan of the micro-LED display technology.
Implementation Method 1
the semiconductor light emitting units of the group and the magnetic device magnetically attract each other, making the semiconductor light emitting units fall into the corresponding alignment positions
Data Source
AI summary
A fabricating method of a semiconductor light emitting device includes disposing a plurality of non-conductive walls on a substrate. An alignment position is formed between every two adjacent non-conductive walls. A plurality of semiconductor light emitting units on a first carrier board are respectively aligned to the alignment positions. The semiconductor light emitting units are divided into a plurality of groups. The semiconductor light emitting units in one of the groups are dissociated from the first carrier board. Thus, the semiconductor light emitting units in the group fall into the corresponding alignment positions due to gravity. Each of the semiconductor light emitting units is electrically connected with the substrate through a first electrode. A conductive layer is formed on the semiconductor light emitting units. Accordingly, the semiconductor light emitting units are electrically connected together to the conductive layer through second electrodes.