Micro LED Display Structure for High-Resolution Matrix Attachment
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Solution Overview
Problem
The manufacturing time and cost of micro LED display devices are increased due to the time-consuming process of mounting individual LEDs on a circuit board, especially as pixel density and resolution rise, making it difficult to achieve high-resolution displays with low thickness, weight, and high yield.
Innovation Solution
A display device structure featuring a matrix of light-emitting diodes and transistors, where the light-emitting diodes are positioned closer to the substrate than the transistors, and are electrically connected through conductive layers, allowing for simultaneous attachment and reducing the complexity of mounting individual LEDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If individual LEDs are mounted on a circuit board using a pick-and-place method, then the display device can be assembled, but the manufacturing time becomes extremely long and manufacturing cost increases
Solution Approach 1:
The patent merges the LED chips and transistor circuits into a single integrated structure where multiple LEDs are formed on the same substrate as their driving transistors. This integration eliminates the need for separate mounting of individual LEDs onto a circuit board, thereby dramatically reducing manufacturing time and complexity while maintaining the ability to assemble the display device.
Solution Approach 2:
The patent performs preliminary actions by pre-forming the LED chips and their driving circuits on the same substrate before final assembly. The LED chips are fabricated with integrated transistor circuits that are already connected to the necessary circuit board connections, so that when the substrate is attached to the circuit board, all connections are established simultaneously in a single step rather than requiring individual component mounting.
2Manufacturing precision
If the number of pixels is increased to achieve high resolution, then the display quality improves, but the number of LEDs to be mounted increases and manufacturing becomes more difficult
Solution Approach 1:
The patent merges multiple LED chips and their driving circuits onto a single substrate, creating an integrated module that can be treated as one unit during assembly. This merging approach allows high-resolution displays with many pixels to be manufactured without proportionally increasing mounting complexity, as the entire array can be attached to the circuit board in a single operation rather than requiring individual mounting of each LED.
Solution Approach 2:
The patent segments the display device into modular components: an integrated substrate containing LED chips and transistor circuits, and a separate circuit board. This segmentation allows the complex high-resolution LED array to be manufactured and tested as a self-contained module, which can then be easily integrated into the final device, thereby managing complexity through modular design.
3Manufacturing precision
If individual LEDs are mounted one by one, then each LED can be precisely positioned, but the manufacturing cost increases and yield decreases
Solution Approach 1:
The patent merges multiple LED chips and their driving circuits into an integrated substrate assembly that is manufactured as a single unit. This approach maintains precise positioning of all LEDs relative to each other through the integrated fabrication process, while simultaneously improving manufacturing yield by reducing the number of separate mounting operations and associated failure points. The entire array can be attached to the circuit board in one step, eliminating cumulative errors from repeated individual mounting operations.
Data Source
AI summary
A display device with high resolution is provided. Manufacturing cost of a display device using a micro LED as a display element is reduced. The display device includes a substrate, a plurality of transistors, and a plurality of light-emitting diodes. The plurality of light-emitting diodes are provided in a matrix over the substrate. Each of the plurality of transistors are electrically connected to at least one of the plurality of light-emitting diodes. The plurality of light-emitting diodes are positioned closer to the substrate than the plurality of transistors are. The plurality of light-emitting diodes emit light to the opposite side of the substrate.