Micro LED Matrix Module Layout for Pad Reduction and Bonding Yield
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Solution Overview
Problem
The existing micro LED display modules face challenges with pad quantity and bonding yield due to the need for multiple pads per LED, leading to size and spacing limitations and a time-consuming bonding process.
Innovation Solution
A micro LED display matrix module design featuring a multilayer circuit layer with a top and bottom circuit layer, including pads that overlap micro LEDs, an insulating flat layer, and conductive vias, which reduces the number of pads required and improves surface flatness, allowing for better bonding to a display circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If each micro LED is mounted individually onto the driving circuit board with separate pads, then the LED functionality is achieved, but the quantity of pads increases and bonding yield decreases
Solution Approach 1:
The patent combines multiple LED mounting functions into a single integrated circuit board structure. The driving circuit board integrates the driving circuit, control circuit, and LED mounting structure into one unified component, eliminating the need for separate pads for each LED. This merging approach reduces the total quantity of pads required while maintaining reliable bonding through the integrated design.
Solution Approach 2:
The driving circuit board serves multiple functions simultaneously: it provides the driving circuit for LED operation, the control circuit for display management, and the mounting structure for securing LEDs. This multi-functional integration reduces the overall component count and pad requirements while improving bonding yield through a unified bonding interface.
2Productivity
If individual LED encapsulation and mounting is performed, then LED functionality is achieved, but the process is time-consuming and irreparable
Solution Approach 1:
The patent implements preliminary action by pre-assembling the driving circuit and control circuit onto the circuit board before LED mounting. The driving circuit and control circuit are integrated onto the board in advance, creating a prepared substrate that ready for批量 LED bonding. This preliminary preparation enables more efficient subsequent bonding processes and allows for potential rework without complete disassembly.
3Manufacturing precision
If micro LEDs are mounted with traditional spacing requirements, then proper electrical connection is achieved, but surface flatness is compromised
Solution Approach 1:
The patent transitions from traditional planar spacing arrangements to a three-dimensional integrated structure. The driving circuit and control circuit are arranged in multiple layers and dimensions on the circuit board, allowing LEDs to be positioned closer together in the planar view while maintaining proper electrical connections through vertical vias and layered routing. This dimensional change enables reduced spacing while preserving surface flatness.
Data Source
AI summary
The micro light-emitting diode (LED) display matrix module of the disclosure includes a multilayer circuit layer, multiple micro LEDs, and an insulating flat layer. The multilayer circuit layer includes a top circuit layer and a bottom circuit layer. The bottom circuit layer includes multiple pads. The micro LEDs are disposed on the top circuit layer of the multilayer circuit layer and define multiple light-emitting units. Each of the light-emitting units includes three of the micro LEDs that are separated from each other. The light-emitting units are arranged in a matrix of m columns and n rows to define multiple pixel regions, and quantity of the pads is equal to 3m+n. An orthographic projection of each of the micro LEDs on the bottom circuit layer completely overlaps the corresponding pad. The insulating flat layer covers the top circuit layer of the multilayer circuit layer and the micro LEDs.