Micro LED Module Assembly Using Intermediary Substrate Transfer
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Solution Overview
Problem
Micro LED displays face challenges in transferring micro LEDs to circuit boards due to their small size, leading to potential drawbacks in the assembly process.
Innovation Solution
A light emitting device module is developed, featuring a substrate with mounted LEDs, an adhesive layer, and bonding wires, where the substrate includes outer electrodes and the adhesive layer is non-conductive, facilitating the transfer and arrangement of LEDs in a matrix or zigzag form on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If micro LEDs are mounted directly on circuit boards, then assembly precision is improved, but transfer difficulty increases due to very small size
Solution Approach 1:
The patent divides the assembly process into two stages: first mounting micro LEDs on a temporary substrate where they can be easily transferred, then transferring the entire substrate assembly to the final circuit board. This segmentation resolves the contradiction by making the initial mounting easy while achieving precise final positioning.
Solution Approach 2:
The patent introduces a temporary substrate as an intermediary carrier between the micro LED manufacturing process and the final circuit board assembly. This intermediary allows easy transfer of micro LEDs while enabling precise final mounting, resolving the contradiction between transfer difficulty and assembly precision.
2Reliability
If outer electrodes are added to substrate, then electrical connection is improved, but device complexity increases
Solution Approach 1:
The patent merges the electrical connection function with the substrate structure by integrating outer electrodes directly into the substrate design. This combining approach improves electrical connection reliability while avoiding the added complexity of separate connection components.
Data Source
AI summary
A light emitting device module includes a substrate, a plurality of light emitting devices disposed on the substrate, and an adhesive layer disposed between the substrate and at least one of the plurality of light emitting devices. An outer electrode is disposed on the outer region of the substrate.