Micro-LED Chip Structure With Overhanging Emission Layer Edges
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Solution Overview
Problem
Current micro-LED structures face inefficiencies due to surface recombination carrier loss when the light emitting layer aligns with the edges of the conductive layers, leading to reduced light emission efficiency.
Innovation Solution
The micro-LED structure design includes a light emitting layer that extends horizontally away from the edges of the conductive layers, preventing contact and minimizing surface recombination, with additional features like spacers and isolation structures to enhance performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the light emitting layer aligns with the edges of the conductive layers, then the device structure is simpler, but surface recombination carrier loss increases and light emission efficiency decreases
Solution Approach 1:
The light emitting layer is designed with an asymmetric configuration relative to the conductive layers. Specifically, the light emitting layer extends beyond the top edge of the first conductive layer and the bottom edge of the second conductive layer, creating an overhang structure. This asymmetric design prevents the light emitting layer edges from contacting the conductive layer edges, thereby reducing surface recombination and carrier loss while maintaining manufacturing feasibility.
2Loss of energy
If the light emitting layer extends away from the conductive layer edges, then light emission efficiency improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs a multi-layer stack structure where the light emitting layer is positioned between the first and second conductive layers. The extending configuration of the light emitting layer beyond the conductive layer edges is established during the fabrication process, creating a built-in geometric constraint that prevents edge contact. This preliminary structural arrangement ensures reduced surface recombination without requiring ultra-precise alignment during subsequent manufacturing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves light emission efficiency by reducing surface recombination and optimizing carrier injection, resulting in enhanced performance and reliability of the micro-LEDs.
Implementation Method 1
A micro-light emitting diode (micro-LED) is a device that emits light using an electric signal
Data Source
AI summary
A micro-LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer extends along a horizontal level from a top edge of the first type conductive layer and a bottom edge of the second type conductive layer. The micro-LED chip further includes a metal layer formed on a portion of the light emitting layer that extends from the top edge of the first type conductive layer.