Micro LED Package Stacking for Active Matrix Displays
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Solution Overview
Problem
Current display devices using micro LEDs face challenges with increased size of light-emitting element packages due to the integration of driver ICs, leading to higher process costs and light loss, which affects image quality and area utilization.
Innovation Solution
A light-emitting element package design where the light-emitting elements and driving chip are formed as separate layers, allowing for active matrix driving and improved image quality, with the light-emitting elements partially overlapping the driving chip, and using a terminal layer for connection, enabling efficient light emission and reduced package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If the driver IC is disposed on the same layer as the LED, then active matrix driving is achieved, but the size of the light-emitting element package increases
Solution Approach 1:
The patent transitions from planar arrangement to vertical stacking by placing the driver IC and LED in different layers. The driver IC is positioned on a first substrate, the LED is mounted on a second substrate, and these substrates are vertically stacked and connected through conductive structures, effectively utilizing the third dimension to resolve the area conflict.
Solution Approach 2:
The patent implements a nested structure where the LED is mounted on the second substrate, which itself is mounted on the first substrate containing the driver IC. The conductive structure penetrates through the second substrate to electrically connect the LED to the driver IC, creating a compact nested arrangement that minimizes overall package footprint.
2Extent of automation
If the driver IC is disposed on the same layer as the LED, then active matrix driving is achieved, but the number of transfers increases leading to higher process cost
Solution Approach 1:
The patent divides the package into distinct functional segments: the driver IC on the first substrate and the LED on the second substrate. This segmentation allows each component to be manufactured and prepared separately, then assembled through a controlled mounting process, potentially reducing overall manufacturing complexity and cost compared to more transfers.
3Extent of automation
If the driver IC is disposed on the same layer as the LED, then active matrix driving is achieved, but light emitted from the LED is absorbed by the driver IC causing light loss
Solution Approach 1:
By separating the driver IC and LED into different vertical layers, the patent ensures that light emitted by the LED travels in a direction away from the driver IC layer, preventing absorption. The vertical arrangement allows light to exit the package without encountering the driver IC, thereby eliminating this source of energy loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances image quality, increases luminance, reduces material costs, and simplifies the circuit board structure, allowing for more pixels in the same area and enabling the manufacture of new display structures like large-area transparent displays.
Implementation Method 1
LED (light emitting diode), which is a well-known semiconductor light-emitting element that converts electric current into light
Data Source
AI summary
The present disclosure is applicable to a technical field related to a display device, and, for example, relates to a display device using a micro light emitting diode (LED). The present disclosure includes a first layer including a terminal, a second layer (a driving layer) located adjacent to the first layer and including a driving chip, a third layer (a light-emitting layer) located adjacent to the second layer, wherein the third layer includes light-emitting elements, wherein each light-emitting element at least partially overlaps the driving chip in a connection direction of the first layer and the second layer and constitutes a unit subpixel, and a fourth layer located adjacent to the third layer, wherein light emitted from the light-emitting elements passes through the fourth layer, wherein a first electrode of each of the light-emitting elements is connected to a first end of the driving chip and a second end of the driving chip is connected to the terminal.