Micro LED Display Panel Packaging for Electrode-Free Signal Routing
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Solution Overview
Problem
The complexity and high cost of manufacturing micro LED display panels with vertical structures due to the need for precise patterning of metal electrodes, which increases processing difficulty and reduces yield.
Innovation Solution
A display panel design that includes a base substrate with light-emitting devices and package structures, where a first package structure with higher resistivity encapsulates the semiconductor layers and a second package structure with lower resistivity is used to transmit signals, replacing the metal electrode and simplifying the fabrication process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal electrode is used to transmit signals to the second semiconductor layer, then the signal transmission function is achieved, but the processing precision requirement increases and fabrication complexity increases
Solution Approach 1:
The patent changes the key parameter from metal electrode to doped semiconductor layer, transforming the material properties from highly conductive metal to controllable doped semiconductor. This allows signal transmission while reducing processing precision requirements and simplifying fabrication
Solution Approach 2:
The patent applies local doping to specific regions of the semiconductor layer to create conductive pathways where needed, while maintaining insulating properties in other areas. This localized modification achieves signal transmission without requiring precise metal electrode patterning
2Reliability
If a metal electrode is used to transmit signals, then the signal transmission function is achieved, but the fabrication cost increases
Solution Approach 1:
The patent changes the material parameter from expensive metal electrode to cost-effective doped semiconductor layer, achieving signal transmission while reducing fabrication costs through simpler materials and processes
Solution Approach 2:
The patent replaces expensive metal electrodes with a more economical doped semiconductor layer that can be integrated into the existing semiconductor structure, reducing overall fabrication cost
3Reliability
If a metal electrode is used, then the signal transmission function is achieved, but the device structure becomes more complex
Solution Approach 1:
The patent merges the signal transmission function with the existing semiconductor layer by applying doping, eliminating the need for separate metal electrode structures and reducing overall device complexity
Solution Approach 2:
The doped semiconductor layer serves multiple functions: it acts as both the structural base layer and the signal transmission pathway, replacing the dedicated metal electrode function and simplifying the overall structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the demand for processing precision, lowers fabrication costs, and improves yield by allowing the second package structure to be fabricated integrally and omitting the need for a metal electrode, thereby simplifying the panel structure and manufacturing technique.
Implementation Method 1
a resistivity of the first package structure is σ1, a resistivity of the second package structure is σ2, and σ2<σ1
Data Source
AI summary
A display panel, a display apparatus and a method for manufacturing a display panel are provided. The display panel includes: a base substrate; multiple light-emitting devices, where the light-emitting device includes a first semiconductor layer, a second semiconductor layer and a light-emitting layer located between the first and second semiconductor layers, and the second semiconductor layer is located on a side of the light-emitting layer away from the base substrate; a first package structure, located on the side of the base substrate, where the first package structure includes a first package part located between two adjacent light-emitting devices; and a second package structure, where at least part of the second package structure is located on a side of the light-emitting device away from the base substrate, and a resistivity of the first package structure is higher than that of the second package structure.