Micro LED Pad Protrusions for Precise Bonding Alignment
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Solution Overview
Problem
Micro LEDs deviate from their preset positions during the bonding process to a substrate due to heat treatment, leading to defects in the manufacturing of display devices.
Innovation Solution
Incorporating protrusion members made of conductive or insulating materials around the electrode pads on the substrate to guide and fix the micro LEDs in place, ensuring precise positioning and preventing movement during the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If heat treatment is applied during the bonding process of micro LED to substrate, then bonding strength is improved, but micro LED position precision deteriorates due to deviation from preset position
Solution Approach 1:
The protrusion members are formed on the substrate before the micro LED bonding process. These protrusion members pre-establish physical constraints that guide the micro LEDs to their preset positions during bonding, preventing position deviation even when heat treatment is applied for bonding strength.
Solution Approach 2:
The protrusion members act as intermediary structures between the substrate and the micro LEDs. They provide physical guidance and constraints during the bonding process, mediating between the heat treatment required for bonding strength and the position precision requirement, ensuring both are achieved.
2Device complexity
If conventional bonding process is used without protrusion members, then manufacturing process complexity is reduced, but micro LED position precision deteriorates
Solution Approach 1:
The substrate structure is segmented by adding protrusion members that are formed on specific regions of the substrate. This segmentation creates localized positioning features without requiring complete redesign of the entire manufacturing process, maintaining relative simplicity while achieving precise positioning.
Solution Approach 2:
The protrusion members are formed on specific local regions of the substrate where positioning is required, rather than modifying the entire substrate or bonding process. This local modification approach maintains overall process simplicity while achieving the desired positioning precision at critical locations.
Data Source
AI summary
A display apparatus includes a substrate in which a plurality of pads are disposed, a plurality of micro LEDs, wherein each micro LED from among the plurality of micro LEDs is electrically connected to a respective group of pads from among the plurality of pads and mounted on the substrate, and a plurality of protrusion members, wherein each protrusion member from among the plurality of protrusion members protrudes from the substrate and is formed adjacent to a respective pad from among the plurality of pads.


