Micro LED Panel Stacking for Full-Color Mass Transfer
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Solution Overview
Problem
Existing Micro LED display panels face challenges in achieving high yield and transfer efficiency due to incompatibility between massive transfer and bonding technologies, particularly in accurately locating and integrating red, green, and blue chips for full-color displays.
Innovation Solution
A display panel design that integrates three types of red, green, and blue LED epitaxial layers with a TFT device layer in a longitudinal direction, forming a stacked epitaxial layer and reducing the occupied area of each Micro LED display unit, thereby improving resolution and transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate transfer processes are used for red, green, and blue chips to achieve full-color display, then color completeness is improved, but transfer complexity and difficulty increase significantly
Solution Approach 1:
The patent combines red, green, and blue LED chips into a single integrated transfer unit. The transfer substrate simultaneously carries all three color chips, which are pre-positioned in the correct spatial arrangement. This merging approach transforms three separate transfer operations into one single transfer process, dramatically reducing transfer complexity while maintaining full-color display capability.
Solution Approach 2:
The patent implements preliminary positioning and integration of red, green, and blue chips on the transfer substrate before the actual transfer to the display substrate. The chips are pre-assembled in their final spatial configuration, and the transfer substrate includes alignment features that ensure correct positioning. This preliminary action eliminates the need for complex real-time alignment during transfer.
2Ease of operation
If traditional horizontal integration of LED and TFT is used, then device functionality is achieved, but occupied area is large reducing pixel density
Solution Approach 1:
The patent transitions from horizontal integration to vertical integration by stacking the LED layer and TFT layer in the thickness direction. The LED layer is positioned above the TFT layer, with electrical connections extending vertically through insulating layers. This vertical arrangement dramatically reduces the planar footprint of each display unit, enabling higher pixel density while maintaining full device functionality.
3Productivity
If mass transfer of Micro LED chips is implemented, then production efficiency is improved, but bonding yield and transfer efficiency remain incompatible
Solution Approach 1:
The patent introduces a transfer substrate as an intermediary carrier that temporarily holds the integrated red, green, and blue chip units. This transfer substrate includes alignment features and bonding structures that facilitate high-yield transfer to the final display substrate. The intermediary approach enables mass transfer while maintaining bonding yield through standardized interfaces and alignment mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the occupied area of Micro LED display units to one fifth of their original size, enhancing resolution and enabling higher pixel density, while solving the issues of massive transfer and welding, thus improving the overall efficiency and yield of the display panel.
Implementation Method 1
bonding the at least one epitaxial layer and forming a stacked epitaxial layer
Data Source
AI summary
The present disclosure provides a display panel and a method for preparing the same; the display panel includes an LED layer and a TFT device layer disposed on the LED layer, the LED layer includes a first epitaxial layer, a second epitaxial layer, and a third epitaxial layer disposed in stack; and the LED layer form a longitudinal integrated structure.