Micro LED Pick-and-Place Nozzle with Real-Time Imaging
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Solution Overview
Problem
The manufacturing process of micro LED displays faces challenges in efficiently mounting and repairing micro LED chips due to high costs and time requirements, especially in achieving 100% transfer yield, as existing mass transfer technologies struggle with precision and accuracy in positioning and posture monitoring during the chip-repairing process.
Innovation Solution
A pick-and-place apparatus utilizing a capillary nozzle with a nozzle tip smaller than the micro LED chip, combined with real-time imaging and pressure adjustment, allows for precise adsorption, positioning, and mounting of micro LED chips onto repair pixels, incorporating features like flexible coatings, ionizers, and pressing force measurement for accurate placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mass transfer technology is used to simultaneously mount a large number of micro LED chips, then productivity is improved, but manufacturing precision deteriorates due to inability to achieve 100% transfer yield
Solution Approach 1:
The patent divides the transfer process into two distinct stages: mass transfer for high-speed initial mounting, followed by individual pick-and-place transfer for precision repair work. This segmentation allows each process to optimize for its specific function - speed for mass transfer and precision for repair - resolving the contradiction between overall productivity and transfer yield.
Solution Approach 2:
The patent introduces an intermediary inspection and repair process between mass transfer and final product completion. This intermediary stage identifies defective chips and enables individual replacement, serving as a bridge that maintains both the high productivity of mass transfer and the high precision required for 100% yield through selective repair.
2Manufacturing precision
If individual chip mounting is used to ensure precision, then manufacturing precision is improved, but productivity deteriorates due to exponentially increased process time
Solution Approach 1:
The patent segments the mounting process into bulk operations (mass transfer) and individual operations (repair). By performing only necessary individual transfers for defective locations rather than all chips, it achieves both high precision where needed and maintains overall productivity through the efficiency of mass transfer for the majority of chips.
Solution Approach 2:
The patent applies partial individual transfer action - performing individual pick-and-place operations only for defective chips identified during inspection rather than all chips. This partial application of precision-oriented individual transfer maintains productivity while achieving necessary manufacturing precision for repair locations.
3Manufacturing precision
If capillary nozzle with real-time imaging is used for individual chip transfer, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent employs dynamic imaging that captures real-time position and posture information during the transfer process. This dynamic feedback enables precise control of the capillary nozzle's movements and orientation, achieving high manufacturing precision while the system adapts to actual chip locations and orientations rather than relying on fixed pre-programmed positions.
Solution Approach 2:
The patent implements a feedback loop where imaging captures real-time information about chip position and posture, this information is processed by a control system, and the capillary nozzle's actions are adjusted accordingly. This feedback mechanism enables precise individual chip transfer despite the increased device complexity, as the system self-corrects based on actual conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise, real-time monitoring and accurate placement of micro LED chips, reducing defects and increasing yield by allowing for individual chip repair with high precision, thus addressing the limitations of existing mass transfer technologies.
Implementation Method 1
a pressure adjustment part that applies negative pressure inside the nozzle to adsorb the micro LED chip to the nozzle tip
Implementation Method 2
an imaging part that monitors a position and posture of the micro LED chip adsorbed to the nozzle tip in real time
Data Source
AI summary
The present disclosure relates to a pick-and-place apparatus of micro LED chip for chip-repairing of micro LED display, including a nozzle having a capillary form and having a nozzle tip that is smaller than a top size area of the micro LED chip; a pressure adjustment part that applies negative pressure inside the nozzle to adsorb the micro LED chip to the nozzle tip and applies positive pressure inside the nozzle or removes the negative pressure inside the nozzle to mount the micro LED chip adsorbed to the nozzle tip onto a repair pixel; an imaging part that monitors a position and posture of the micro LED chip adsorbed to the nozzle tip in real time; a moving part that moves the nozzle; and a control part that receives image information from the imaging part, and mounts the micro LED chip onto a repair pixel while controlling the pressure adjustment part and the moving part.