Micro LED Positioning Protrusions for Precise Substrate Bonding

A temporary substrate is introduced as an intermediary carrier to hold multiple micro light emitting diodes during the mass transfer process. The temporary substrate enables batch handling and transfer of multiple LEDs simultaneously while maintaining their relative positions, thus improving productivity without sacrificing positioning accuracy. The temporary substrate acts as a mediator between the growth substrate and the circuit substrate, allowing precise positioning through alignment features.

Positioning protrusions are pre-formed on the circuit substrate before the transfer process. These protrusions create positioning spaces that guide and constrain the placement of micro light emitting diodes, ensuring accurate positioning before bonding occurs. This preliminary preparation of the circuit substrate enables precise alignment during the subsequent transfer operation.

The positioning function is segmented from the main circuit substrate by adding separate positioning protrusions. These protrusions are discrete structural elements that can be independently formed through standard semiconductor fabrication processes such as photolithography and etching. This segmentation allows the positioning features to be integrated into the existing manufacturing flow without fundamentally changing the substrate structure.

The positioning protrusions serve multiple functions: they define positioning spaces for accurate LED placement, provide mechanical support, and can be integrated with the electrical bonding structure. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving improved positioning accuracy.