Micro LED Quantum Dot Bonding to Eliminate Color Crosstalk

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Solution Overview

Problem

Existing full-color Micro LED displays face challenges with substrate peeling difficulty and light-color crosstalk, particularly in transfer and quantum dot-based solutions.

Innovation Solution

A method involving preparing Micro LED chips on a substrate, grinding and cutting, flip-bonding on a driving basal plate, peeling the substrate, and fabricating quantum dot conversion devices independently on a transparent basal plate, followed by alignment and bonding with a monochrome Micro LED module base to form a color Micro LED display chip module.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If quantum dots are processed on the substrate layer in the prior art, then the conversion layer can be formed, but the fabrication efficiency is low and substrate peeling is difficult

Engineering Contradiction:

Improvefabrication efficiencyVSAvoidsubstrate peeling difficulty

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The patent divides the manufacturing process into separate stages: first forming the quantum dot conversion device independently on a transparent basal plate, then bonding it to the Micro LED chip. This segmentation allows independent optimization of each component and eliminates the need to peel the substrate from the entire chip wafer, thereby improving both fabrication efficiency and ease of manufacture.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The quantum dot conversion device is prepared in advance on a transparent basal plate before being bonded to the Micro LED chip. This preliminary action allows the conversion layer to be fabricated separately with optimized processes, improving fabrication efficiency while avoiding substrate peeling difficulties during final assembly.

Inventive Principle:

Principle #10Preliminary action

2Illumination intensity

If a simple quantum dot layer is used, then the structure is simple, but light intensity is insufficient and light-color crosstalk occurs

Engineering Contradiction:

Improvelight intensityVSAvoidconversion device structure

Core Design Contradiction:

Illumination intensityVSDevice complexity

Solution Approach 1:

The patent employs a composite structure combining quantum dots with a protective layer and metal reflective layer. The quantum dots provide color conversion, the protective layer preserves quantum dot properties, and the metal reflective layer enhances light intensity by reflecting light back through the quantum dots, thereby improving illumination while managing structural complexity.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent replaces simple physical stacking with a functional composite structure where the metal reflective layer optically enhances the quantum dot emission. This substitution of optical enhancement for mechanical complexity allows improved light intensity without proportionally increasing structural complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method simplifies substrate peeling, improves fabrication efficiency, enhances light intensity, and eliminates light-color crosstalk in Micro LED displays by using a quantum dot-protective layer-metal reflective layer-metal isolating layer structure.

Implementation Method 1

filling a quantum dot light-color converter in the quantum dot hole site

Methodology Applied

Scientific EffectPhotoluminescence: Photoluminescence

Implementation Method 2

preparing a metal reflective layer at positions between the quantum dot hole sites above the quantum dot protective layer

Methodology Applied

Scientific EffectReflection: Reflection

Data Source

PatentUS12538631B2Method for manufacturing color Micro LED display chip module

Publication Date: 2026.01.27 FUJIAN PRIMA OPTOELECTRONICS CO LTD

AI summary

The present disclosure discloses a method for manufacturing a color Micro LED display chip module, comprising preparing a Micro LED chip on a substrate, grinding and cutting the chip and then flip-bonding same on a driving basal plate, and peeling the substrate from the chip. Through fabricating a quantum dot hole site corresponding to a sub-pixel unit position of a chip on a transparent basal plate and filling a quantum dot light-color converter in the quantum dot hole site and depositing a quantum dot protective layer, a conversion device is fabricated independently on the transparent basal plate. Compared with processing a conversion layer on a substrate layer in the prior art, inverting a full-color quantum dot conversion device and then aligning and bonding same with the integrated monochrome Micro LED module base can improve the fabrication efficiency, eliminate the crosstalk between light and color in full-color Micro LED display.