Micro LED Display Panel Layout With Rear Driver IC for Bezel Reduction
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Solution Overview
Problem
Display apparatuses face challenges in minimizing bezel size, particularly when incorporating driver IC regions, which limits the configuration of large-sized displays and increases manufacturing costs due to the use of specialized substrates and processes.
Innovation Solution
The display apparatus relocates the driver IC chip to the back side of the light emitting surface, utilizing a general substrate and conventional thin film transistor processes, and incorporates a light emitting diode with a p-n diode structure, anode, and cathode, connected via an upper electrode, with a repair light emitting diode system for reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If driver IC region is located at the edge of display panel, then driver IC can be connected to pixels, but bezel size increases
Solution Approach 1:
The driver IC chip is relocated from the lateral edge (2D plane) to the back side (3D space) of the display panel, utilizing the Z-dimension to resolve the conflict between bezel size and driver IC connection. This allows the front surface to be fully utilized for display while the driver IC is positioned on the rear surface, connected through conductive structures.
2Ease of manufacture
If specialized substrate and processes are used for driver IC integration, then driver IC can be integrated, but manufacturing complexity and cost increase
Solution Approach 1:
The display panel is divided into functionally independent layers: the front display surface with pixels, the intermediate connection layer with conductive structures, and the rear mounting surface for driver IC. This segmentation allows each layer to be optimized and manufactured separately using conventional processes, then assembled together, avoiding the need for complex integrated substrates.
Solution Approach 2:
A general-purpose substrate is used that can serve multiple functions: supporting the pixel array, providing mechanical structure, and mounting the driver IC chip on its back surface. This universal substrate replaces specialized integrated substrates, simplifying manufacturing while achieving both display and driver integration functions.
3Area of stationary object
If driver IC is moved to back side, then bezel is minimized, but connection structure between driver IC and pixels becomes more complex
Solution Approach 1:
The connection structure is nested within the multi-layer substrate architecture, with conductive structures embedded in intermediate layers between the front pixel surface and the rear driver IC mounting surface. This nesting approach conceals the complex connection paths within the substrate thickness, maintaining a clean front surface while achieving electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes or eliminates the bezel, allows for larger display configurations through modular panels, reduces manufacturing complexity and costs, and enhances durability and color reproducibility by using micro LEDs instead of organic LEDs.
Implementation Method 1
a light emitting diode disposed on the first insulating layer to emit light toward the substrate and including a p-n diode
Data Source
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AI summary
The present disclosure relates to a display apparatus including a substrate, a thin film transistor disposed on the substrate, a first insulating layer disposed on a source electrode and a drain electrode of the thin film transistor, a light emitting diode disposed on the first insulating layer to emit light toward the substrate, a second insulating layer disposed on the first insulating layer to surround the light emitting diode, an upper electrode disposed on the second insulating layer, and a driver IC chip disposed above the upper electrode to be connected to the upper electrode. According to the above configuration, the driver IC chip is disposed on the back side of a light emitting surface of a display panel, so that a bezel is capable of being minimized or omitted, and manufacturing of the display apparatus is easy and manufacturing costs is reduced.