Micro LED Transfer Using Recessed Side Walls for High Yield
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Solution Overview
Problem
Current methods for manufacturing large-screen displays using micro-sized semiconductor light-emitting elements face challenges in achieving high transfer yield and reliability, especially when the size of the semiconductor light-emitting elements is reduced or the magnetic force acting on them is weakened.
Innovation Solution
The proposed solution involves a display device with semiconductor light-emitting elements having recessed portions on their side surfaces, inclined with respect to the substrate, and a self-assembly method using a combination of magnetic and electric fields to guide the elements to precise positions, minimizing tailing and non-specific binding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the size of semiconductor light-emitting elements is reduced to increase display resolution, then the display quality is improved, but the transfer yield decreases due to difficulty in handling and positioning
Solution Approach 1:
The semiconductor light-emitting element is segmented by forming recessed portions on its side surface, creating multiple engagement points that improve positioning accuracy and transfer yield despite the element's small size
Solution Approach 2:
The recessed portions are formed on the side surface of the semiconductor light-emitting element, utilizing the lateral dimension for positioning rather than relying solely on the top surface, thereby improving transfer precision without increasing element size
2Productivity
If self-assembly method is used to transfer millions of semiconductor light-emitting elements for large-sized display, then the productivity is improved, but the transfer yield decreases when magnetic force acting on the elements is weakened
Solution Approach 1:
The recessed portions divide the magnetic interaction into multiple localized points on the side surface, allowing effective magnetic force application even when the overall element size and total magnetic moment are reduced
Solution Approach 2:
The invention replaces reliance on strong magnetic fields with a geometric positioning system using recessed portions that work in conjunction with weakened magnetic forces, substituting pure magnetic attraction with a combined geometric-magnetic positioning mechanism
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for high-yield, cost-effective, and high-speed transfer of micro light-emitting diodes onto large-area substrates, maintaining assembly efficiency even when the size of the semiconductor light-emitting elements is minimized.
Implementation Method 1
transferring a magnet disposed on one side of the substrate along one direction to move the semiconductor light-emitting elements accommodated in the fluid chamber along the one direction
Implementation Method 2
at least one of inner walls of each of the recessed portions is formed to be inclined with respect to one surface of the semiconductor light-emitting element in contact with the substrate
Implementation Method 3
applying power to a plurality of electrodes disposed on an assembly surface of the substrate to guide the semiconductor light-emitting elements to preset positions
Data Source
AI summary
The present invention relates to a display device and a method of manufacturing same, and more particularly, to a display device using semiconductor light-emitting elements each having a size that is several to several tens of um, and to a method of manufacturing same. The present invention provides a display device comprising a substrate including a wiring electrode, and a plurality of semiconductor light-emitting elements electrically connected to the wiring electrode, wherein each of the semiconductor light-emitting elements is provided with a plurality of recessed portions formed on a side surface thereof, and at least one of inner walls of each of the recessed portions forms an inclination with respect to one surface of a semiconductor light-emitting element that is in contact with the substrate.