Micro LED Reflective Structures for Lateral Light Extraction
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Solution Overview
Problem
Lateral lights emitted by adjacent LED chips in LED light source modules are absorbed, leading to decreased light emitting efficiency and non-uniformity.
Innovation Solution
A light emitting device with micro light emitting chips, reflective structures, and conductive bumps, where the reflective structures are disposed around the chips to cover the light emitting layers, enhancing forward light flux and reducing lateral light flux, thereby improving light emitting efficiency and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If LED chips are arranged in a matrix on a substrate, then the light emitting device can be manufactured with standard fabrication processes, but lateral lights emitted by adjacent LED chips are absorbed by each other, decreasing light emitting efficiency
Solution Approach 1:
The patent divides the light emitting structure into discrete micro light emitting chips arranged in a matrix, with each chip having independent reflective structures. This segmentation allows each chip to control its own light emission patterns while maintaining manufacturability through standard array fabrication processes.
Solution Approach 2:
The patent converts the harmful lateral light absorption between adjacent chips into a beneficial reflection pattern by introducing reflective structures. These structures redirect what would be absorbed lateral light into useful forward or oblique directions, transforming the problematic interaction into an enhanced light output mechanism.
2Loss of energy
If reflective structures are added around micro light emitting chips to redirect lateral light, then light emitting efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges the reflective structures with the substrate or packaging material, integrating the light redirecting function into the existing device architecture. This consolidation adds the necessary optical control while minimizing additional structural complexity by combining multiple functions into unified components.
Solution Approach 2:
The reflective structures are designed to automatically redirect lateral light without requiring external control mechanisms. The geometric configuration of these structures inherently performs the light redirection function, eliminating the need for additional actuators or control systems and thus adding minimal complexity.
3Illumination intensity
If reflective structures cover light emitting layers, then forward light flux is enhanced and light emitting uniformity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies reflective structures with specific local configurations around each micro light emitting chip, optimizing the light reflection pattern for each position in the matrix. This localized approach enhances light emitting uniformity across the entire device while allowing manufacturing tolerances to be managed at the individual chip level rather than requiring perfect global alignment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances light emitting efficiency and uniformity by reflecting lights emitted by the micro light emitting chips, ensuring better forward light flux and reduced lateral light flux, resulting in improved performance.
Implementation Method 1
the reflective structures are disposed around the micro light emitting chips in dispersion, and at least cover the light emitting layers of the micro light emitting chips
Data Source
AI summary
A light emitting device includes a substrate, a plurality of micro light emitting chips, a plurality of reflective structures and a plurality of conductive bumps. The substrate has a plurality of pads. The micro light emitting chips are disposed on the substrate in dispersion, and each of the micro light emitting chips includes a light emitting layer. The reflective structures are disposed around the micro light emitting chips in dispersion, and at least cover the micro light emitting layers of the light emitting chips. The conductive bumps are disposed corresponding to the micro light emitting chips and located between the micro light emitting chips and the substrate, wherein the micro light emitting chips are electrically connected to the pads of the substrate through the conductive bumps.