Micro LED Package Relay Electrodes for Fine-Pitch Display Connection
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Solution Overview
Problem
The challenge lies in connecting micro LED chips to a display's driving connection electrode unit without rearranging or redesigning the electrode unit, especially as micro LED chip sizes decrease, and in preventing wiring disconnection during the curing process of the passivation layer.
Innovation Solution
A micro LED package is developed with a temporary substrate, passivation layers, and wiring layers that allow micro LED chips to be easily connected to the display's driving connection electrode unit without requiring high-precision materials or equipment, and a method for replacing defective chips before transfer to a main substrate, ensuring stable connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If micro LED chip size is reduced, then display resolution and pixel density are improved, but mounting precision requirements and connection difficulty increase
Solution Approach 1:
The patent introduces a connection electrode unit with a relay electrode structure as an intermediary between the micro LED chip and the driving connection electrode unit. This relay electrode acts as a mediator that compensates for alignment errors and facilitates connection even when mounting precision is limited, thereby resolving the contradiction between improved display resolution and increased mounting precision requirements
Solution Approach 2:
The connection electrode unit is segmented into multiple functional layers including a substrate, driving connection electrodes, and relay electrodes. This segmentation allows each layer to perform its specific function independently, with the relay electrode layer specifically designed to handle alignment tolerances and connection challenges associated with smaller micro LED chips
2Measurement precision
If micro LED chip size is reduced, then pixel density is improved, but electrode size and connection area are reduced
Solution Approach 1:
The patent extends the connection structure into the vertical dimension by creating a multi-layer electrode architecture. The relay electrode protrudes upward from the substrate surface, adding vertical height to the connection interface. This dimensional extension compensates for the reduced horizontal electrode area, maintaining sufficient connection area despite smaller micro LED chip sizes
Solution Approach 2:
The relay electrode is pre-formed on the substrate before micro LED chip mounting. This preliminary action creates a ready-made connection interface that accommodates the smaller electrode size of reduced-scale micro LED chips, ensuring adequate connection area is available before the actual mounting process occurs
3Reliability
If passivation layer is formed to enclose wiring layers, then insulation and protection are improved, but wiring disconnection during curing may occur
Solution Approach 1:
The patent applies a reinforcement structure at the interface between the passivation layer and wiring layers before the disconnection problem occurs during curing. This preliminary anti-action counteracts the stress and deformation that would otherwise cause wiring disconnection, maintaining both insulation reliability and wiring connection strength throughout the curing process
Data Source
AI summary
The present invention relates to a micro LED package, a display having the same, and a method for manufacturing the display and, more specifically, to a micro LED package, a display having the same, and a method for manufacturing the display, in which a plurality of micro LEDs having different colors are packaged in a single pixel unit or a plurality of pixel units to facilitate connection to a driving connection electrode unit of the display. In the micro LED package and the display having the same according to the present invention, even if the size of the micro LED chips becomes small, the driving connection electrode unit of the display may be easily connected to the display driving connection electrode unit without rearranging or redesigning the driving connection electrode unit of the display, thereby making it possible to utilize the driving connection electrode unit of the existing display.