Micro-LED Repairing Component with Anisotropic Conductive Layer

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Solution Overview

Problem

There is no suitable method for replacing a defective micro-LED chip in a micro-LED display without causing short-circuits due to the close spacing and small size of the chips, as existing methods like laser removal can damage adjacent non-defective chips and bonding agents can lead to electrical shorts.

Innovation Solution

A repairing component comprising a micro-LED chip with an anisotropic conductive layer matching the electrode plane, allowing for precise electrical connection without damaging adjacent chips, and a method involving laser removal of the conductive layer to facilitate easy replacement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a bonding agent is used to electrically connect a substrate and a micro-LED chip for replacement, then electrical connection is achieved, but the bonding agent may come into contact with adjacent micro-LED chips causing short-circuits

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidshort-circuit risk

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The anisotropic conductive layer is divided into multiple independent laminate units, each containing a micro-LED chip and its corresponding anisotropic conductive layer. This segmentation isolates the conductive material to specific locations, preventing it from contacting adjacent chips and causing short-circuits while maintaining reliable electrical connections at each connection point.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The anisotropic conductive layer is applied locally only where electrical connection is needed between the substrate and micro-LED chip, rather than as a continuous layer. This localized application ensures conductivity where required while avoiding contact with adjacent chips, eliminating the short-circuit risk.

Inventive Principle:

Principle #3Local quality

2Ease of repair

If laser is applied to remove a defective micro-LED chip together with the anisotropic conductive layer, then the defective chip is removed, but a single non-defective micro-LED chip cannot be electrically connected to the substrate

Engineering Contradiction:

Improvedefective chip removalVSAvoidelectrical connection capability

Core Design Contradiction:

Ease of repairVSReliability

Solution Approach 1:

Each micro-LED chip is paired with its own dedicated anisotropic conductive layer forming a separate laminate unit. When a defective chip is removed with laser, only that specific laminate unit is affected while other laminate units remain intact. This allows non-defective chips to maintain their electrical connections to the substrate.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The anisotropic conductive layer is pre-applied to the substrate at each chip location before chip mounting. This preliminary preparation ensures that when chips are removed and replaced, the conductive layer is already in position to enable immediate reconnection of functional chips without requiring reapplication of bonding agents.

Inventive Principle:

Principle #10Preliminary action

3Manufacturing precision

If micro-LED chips are placed on a display substrate with high density, then display resolution is improved, but the gap between chips becomes narrow making replacement difficult

Engineering Contradiction:

Improvechip placement precisionVSAvoidchip replacement ease

Core Design Contradiction:

Manufacturing precisionVSEase of repair

Solution Approach 1:

Each micro-LED chip is associated with its own discrete anisotropic conductive layer, creating independently manageable laminate units. This segmentation allows precise handling and replacement of individual chips even in high-density arrangements, as each chip can be accessed and replaced without affecting neighboring chips.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The anisotropic conductive layer acts as an intermediary element between the substrate and micro-LED chip. This intermediary structure facilitates precise alignment and electrical connection while enabling easy replacement, as the conductive layer remains on the substrate to guide repositioning of replacement chips in high-density configurations.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the easy replacement of defective micro-LED chips without causing short-circuits, ensuring reliable electrical connections and maintaining the display's functionality.

Implementation Method 1

an anisotropic conductive layer disposed to be in contact with an electrode disposed on an electrode plane of the micro-LED chip, wherein the anisotropic conductive layer has an area matching with an area of the electrode plane

Methodology Applied

Scientific EffectAnisotropic conduction: Anisotropy

Implementation Method 2

If the defective micro-LED chip is removed together with the anisotropic conductive layer by applying laser

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS20230015183A1Repairing component including micro-led chip and production method thereof, repairing method, method for producing light emitting device, and light emitting device

Publication Date: 2023.01.19 DEXERIALS CORP

AI summary

A repairing component including a micro-LED chip including an electrode and having an electrode plane on which the electrode is disposed, and an anisotropic conductive layer disposed to be in contact with the electrode disposed on the electrode plane of the micro-LED chip, where the anisotropic conductive layer has an area matching with an area of the electrode plane.