Micro-LED Array Precursor With Same-Side Contacts and Polarized Emission
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Solution Overview
Problem
Conventional micro-LED array manufacturing methods are inefficient, requiring numerous processing steps and limiting pixel yield, luminosity, and energy efficiency, while also complicating the integration of polarized light emission.
Innovation Solution
A method for forming LED array precursors with microstructures and quantum structures on a substrate, where electrical contacts are formed on the epi surface side, reducing processing steps and enhancing luminosity and energy efficiency, and allowing for improved control of light polarization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional manufacturing methods with multiple processing steps are used, then electrical contacts can be formed on opposite sides of the substrate, but the production time increases and device complexity increases
Solution Approach 1:
The substrate is divided into multiple regions with different functional layers (first semiconductor layer, second semiconductor layer, active layers, quantum structures) arranged in a segmented pattern, allowing simultaneous formation of multiple electrical contacts on the same side without interfering with each other
Solution Approach 2:
The invention transitions from the conventional two-sided contact configuration to a single-sided contact configuration by utilizing the planar dimension of the substrate surface, arranging all electrical contacts on the same side in different regions, thereby eliminating the need for backside processing steps
2Reliability
If conventional manufacturing methods are used, then individual components can be assembled, but pixel yield decreases and production efficiency is reduced
Solution Approach 1:
Multiple functional layers (semiconductor layers, active layers, quantum structures, electrical contacts) are merged into a single integrated structure formed on the same substrate, eliminating the need for separate component assembly and picking/placing operations while maintaining individual addressability of each emitter
Solution Approach 2:
All electrical contacts and functional layers are pre-formed on the substrate before final assembly, allowing for precise positioning and reducing the risk of damage during handling and transfer operations
3Reliability
If electrical contacts are formed on opposite sides of the substrate, then electrical connection is achieved, but the number of processing steps increases
Solution Approach 1:
Instead of forming electrical contacts on opposite sides of the substrate as in conventional designs, the invention inverts the approach by forming all electrical contacts on the same side (epi surface side), utilizing the planar arrangement to achieve electrical connection without requiring substrate flipping or backside processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in more homogeneous LED arrays with improved pixel yield, reduced processing steps, higher luminosity, and compact dimensions, enabling efficient energy use and effective light emission control.
Implementation Method 1
LEDs are typically semiconductor-based light sources that emit light when a current is applied
Implementation Method 2
improved control the direction of polarization of the emitted light
Data Source
Figure 1a~1b
Figure 2a~2c
Figure 3~4
AI summary
The present disclosure provides a manufacturing method of forming a light-emitting diode (LED) array precursor (10), and LED arrays precursors, LED arrays and devices comprising the same. The method comprises: providing a substrate (100); forming one or more first layers (120) on an epi surface side (102) of the substrate, wherein the one or more first layers at least comprise a first semiconductor layer (120b) and wherein further one or more first layers, if any, further comprise buffer layers (120a) stacked between the substrate and the first semiconductor layer; selectively masking said one or more first layers by thereon depositing one or more masking layers (140) wherein unmasked portions of said one or more first layers form a plurality of apertures (142); forming microstructures (160) within at least part of the apertures, wherein the microstructures are in physical contact with the first semiconductor layer; forming both anode and cathode electrical contacts (180a,b) on the epi surface side (102) of the substrate (100).