Spliced Micro LED Panel Layout for Less Visible Seams
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional micro light-emitting-diode display panels face limitations in size and spacing due to sequential encapsulation of red, green, and blue LEDs, leading to unsatisfactory bonding yield and time-consuming processes, especially when combined with integrated circuits.
Innovation Solution
The spliced micro light-emitting-diode display panel configures multiple micro light-emitting-diode modules on smaller-sized circuit boards with specific gap arrangements and light-shielding parts to form a larger display panel, reducing transfer time and improving bonding yield while enhancing display quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional sequential encapsulation of red, green, and blue LEDs is used, then each LED can be individually controlled, but the bonding yield is unsatisfactory and the process is time-consuming
Solution Approach 1:
The display panel is divided into multiple spliced modules, each containing micro LED arrays. This segmentation allows parallel processing of multiple modules simultaneously, improving bonding yield and reducing overall process time while maintaining individual control capability
Solution Approach 2:
The patent pre-arranges the spatial configuration of micro LEDs with different gap sizes before bonding. The first gap (between adjacent micro LEDs on different substrates) is designed to be smaller than the second gap (between micro LEDs on the same substrate), optimizing light emission uniformity and reducing visible splicing seams before the actual bonding process
2Area of stationary object
If micro LED modules are spliced to form larger display panels, then display size is increased, but splicing seams become visible affecting image quality
Solution Approach 1:
The patent applies different gap sizes at different locations: the first gap between adjacent micro LEDs on different substrates is smaller than the second gap between micro LEDs on the same substrate. This local variation in gap size optimizes light emission uniformity at splicing seams while maintaining overall display quality
Solution Approach 2:
The patent converts the potentially harmful visible splicing seams into a benefit by strategically positioning and sizing gaps. The smaller first gap at splicing interfaces reduces the visibility of seams, turning what would be a defect into an aesthetic feature that enhances overall image quality
3Object-affected harmful factors
If light-shielding parts are added to cover connecting components, then interference is minimized, but device complexity increases
Solution Approach 1:
The light-shielding parts serve multiple functions: they block light interference from connecting components, provide mechanical support for mounting micro LED modules, and contribute to the overall structural integrity of the display panel. This multi-functionality reduces the need for additional separate components
Solution Approach 2:
The patent merges the light-shielding function with the structural support function by integrating the light-shielding parts into the overall mounting structure. This combination eliminates the need for separate light-shielding components, reducing device complexity while maintaining both optical and mechanical performance
Data Source
AI summary
A spliced micro light-emitting-diode display panel includes multiple circuit boards spliced with each other and multiple micro light-emitting-diode modules. Each circuit board includes at least one driver IC. The micro light-emitting-diode modules are disposed separately on each circuit board and are electrically connected to the driver IC. Each micro light-emitting-diode module includes multiple light-emitting-diode units arranged in an array. On each circuit board, the driver IC drives the light-emitting-diode units of the micro light-emitting-diode modules to emit light. There is a first gap between any adjacent two of the light-emitting-diode units on any adjacent two of the circuit boards, and there is a second gap between any adjacent two of the light-emitting-diode units on each micro light-emitting-diode module, and the first gap is smaller than the second gap.