Micro-LED Chip Segmentation for Stable Mass Transfer

The patent divides a large-area light emitting diode chip into multiple smaller second semiconductor patterns on a single substrate. Each pattern can be independently addressed and controlled, effectively segmenting the chip into multiple functional units while maintaining a manageable number of particles for transfer. This segmentation allows the transferring process to handle fewer, larger units rather than many tiny independent particles, improving transfer stability and accuracy while still providing sufficient light emitting area through the combined output of multiple patterns.

The patent merges multiple second semiconductor patterns onto a single substrate, creating one integrated chip unit that contains multiple functional elements. This merging approach reduces the total number of particles that need to be transferred and managed, simplifying the transferring process while maintaining a large effective light emitting area through the combined functionality of multiple patterns on each chip.

The patent arranges multiple second semiconductor patterns in a two-dimensional array on a single substrate, utilizing spatial distribution across the substrate surface. This dimensional arrangement allows multiple light emitting elements to be packed efficiently within the chip area, reducing the effective spacing between functional pixels while maintaining manageable particle size for transfer. The patterns are distributed across the substrate plane rather than being sequentially arranged, optimizing both density and transferability.