Micro-LED Chip Structure With Shared Emission Layer Edge Isolation
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Solution Overview
Problem
Current micro-LED structures face inefficiencies due to surface recombination carrier loss at the edges of the light emitting layer, which affects light emission efficiency, particularly when the light emitting layer edges align with the conductive layer edges.
Innovation Solution
The micro-LED structure design includes a light emitting layer that extends horizontally away from the edges of the conductive layers, ensuring no contact between the light emitting layer edges and the conductive layer edges, thereby preventing surface recombination and enhancing light emission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the light emitting layer edges align with the conductive layer edges, then the device structure is simplified and easier to manufacture, but surface recombination carrier loss occurs at the edges reducing light emission efficiency
Solution Approach 1:
The light emitting layer is extracted or separated from direct contact with the conductive layer edges by extending the conductive layer beyond the light emitting layer boundaries. This creates a spatial separation that removes the harmful edge interaction while maintaining manufacturing simplicity.
Solution Approach 2:
The solution extends the conductive layer in the horizontal plane beyond the light emitting layer edges, adding a dimensional buffer zone. This spatial extension in the planar dimension prevents edge contact without complicating the vertical stacking structure.
2Device complexity
If the light emitting layer edges contact the conductive layer edges, then the structural alignment is simplified, but light emission efficiency decreases due to surface recombination
Solution Approach 1:
The harmful edge contact is extracted or removed by extending the conductive layer horizontally beyond the light emitting layer. This separation eliminates the surface recombination pathway while keeping the overall structural alignment straightforward.
Solution Approach 2:
The extended conductive layer acts as an intermediary buffer zone between the light emitting layer edges and the external environment. This intermediate region prevents direct edge contact and the associated surface recombination losses.
3Reliability
If the light emitting layer extends horizontally away from the conductive layer edges, then surface recombination is prevented and light emission efficiency improves, but the device structure becomes more complex
Solution Approach 1:
The conductive layer is designed with non-uniform dimensions, extending locally beyond the light emitting layer edges only in the horizontal plane where it is needed to prevent surface recombination. The rest of the structure maintains standard alignment, applying complexity only where necessary.
Solution Approach 2:
The solution addresses the efficiency problem by modifying the conductive layer in the horizontal dimension rather than complicating the vertical stacking sequence. This dimensional approach prevents surface recombination while maintaining structural simplicity in the primary fabrication direction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves light emission efficiency by preventing surface recombination carrier loss, leading to enhanced performance and reliability of the micro-LEDs.
Implementation Method 1
A micro-light emitting diode (micro-LED) is a device that emits light using an electric signal
Data Source
AI summary
A micro-LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, and the multiple micro-LEDs sharing the light emitting layer. The micro-LED chip further includes: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer; and an isolation structure formed between adjacent micro-LEDs.