Micro LED Light-Blocking Structure for Damage-Free Transfer Assembly
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Solution Overview
Problem
Conventional micro light emitting diode structures face damage and low yield during the fabrication of light blocking structures due to lithography processes, leading to poor structural reliability and efficiency.
Innovation Solution
A micro light emitting diode structure is designed with light blocking structures that include a light blocking layer and a light shielding layer, where the reflectivity and Young's modulus of the light blocking layer are greater than those of the connection layer, allowing for alternate arrangement and fixation on a temporary substrate, enhancing structural reliability and manufacturing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the light blocking structure is manufactured after the micro light emitting diode is transferred onto the temporary substrate using lithography processes, then the light blocking structure can be formed, but the micro light emitting diode may be damaged easily
Solution Approach 1:
The light blocking structure is manufactured on the original substrate before the micro light emitting diode is transferred onto the temporary substrate. This preliminary fabrication avoids subsequent lithography damage to the transferred diode while maintaining the light blocking function in the final assembly.
2Ease of manufacture
If the light blocking structure is manufactured on the temporary substrate, then the light blocking function is achieved, but the efficiency of development and peeling may be poor
Solution Approach 1:
The light blocking structure is fabricated on the original substrate before transfer, eliminating the need for subsequent development and peeling operations on the temporary substrate. This preliminary fabrication improves overall process efficiency while achieving the light blocking function.
3Manufacturing precision
If conventional lithography processes are used to manufacture the light blocking structure, then the light blocking pattern can be formed, but the yield is reduced
Solution Approach 1:
The light blocking structure is formed on the original substrate using conventional lithography before the micro light emitting diode transfer process. This preliminary patterning avoids exposure of the transferred diode to damaging lithography processes, thereby maintaining pattern precision while improving overall production yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces damage and improves the yield of micro light emitting diode structures by transferring light blocking structures and micro light emitting elements onto a temporary substrate, resulting in improved structural reliability and display performance.
Implementation Method 1
A reflectivity of the light blocking layer is greater than a reflectivity of the connection layer
Data Source
AI summary
A micro light emitting diode structure includes a temporary substrate, a plurality of micro light emitting elements, a plurality of light blocking structures, and a connection layer. The micro light emitting elements and the light blocking structures are disposed on the temporary substrate and arranged alternately. Each of the light blocking structures includes a light blocking layer, and a light shielding layer disposed on the light blocking layer. The micro light emitting elements and the light blocking structures are fixed to the temporary substrate by the connection layer. A reflectivity of the light blocking layer is greater than a reflectivity of the connection layer, and a Young's modulus of the light blocking layer is greater than a Young's modulus of the connection layer.


