Micro-LED Side Electrode Structure for Fluid-Based Assembly
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Solution Overview
Problem
Micro-LED elements face challenges in achieving excellent emission properties and efficient assembly due to their small size and vulnerability to external factors, and existing technologies struggle to integrate them effectively into display apparatuses.
Innovation Solution
A micro-LED element with a multilayer electrode part on its outer circumferential surface, comprising an n-type semiconductor layer, an active layer, a p-type semiconductor layer, and an insulation layer, is manufactured using a fluid-based assembly process, ensuring excellent emission properties and efficient assembly into display apparatuses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a micro-LED element is used in a display apparatus, then durability and lifespan are improved due to inorganic material properties, but emission properties and assembly efficiency are worsened due to small size and vulnerability to external factors
Solution Approach 1:
The patent segments the micro-LED element into distinct functional layers (n-type semiconductor layer, active layer, p-type semiconductor layer, insulation layer, and multilayer electrode part) to optimize each layer's properties independently, thereby improving emission characteristics while maintaining the inherent durability of inorganic materials
Solution Approach 2:
The patent employs composite material structures by combining multiple semiconductor layers with different properties (n-type and p-type) and integrating them with insulation and electrode materials to achieve superior emission properties while preserving the robustness of inorganic compounds
2Use of energy by moving object
If the size of LED element is reduced to micro-scale (100 μm or less), then power consumption and heat generation are reduced, but assembly efficiency and emission properties are worsened
Solution Approach 1:
The patent implements preliminary action by pre-forming the complete micro-LED structure with all necessary layers and electrode parts in a integrated manufacturing process, which simplifies subsequent assembly operations and improves overall assembly efficiency despite the small size of the elements
Solution Approach 2:
The patent optimizes emission properties by carefully controlling the thickness and material composition parameters of each layer in the micro-LED structure, achieving excellent light emission while maintaining low power consumption characteristic of micro-scale devices
3Ease of manufacture
If a simple single-layer electrode structure is used on micro-LED, then manufacturing process is simplified, but emission properties are insufficient
Solution Approach 1:
The patent applies composite material principles by creating a multilayer electrode structure where each layer serves a specific function (electrical connection, light reflection, adhesion), achieving superior emission properties through material composition optimization while maintaining manufacturing feasibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The micro-LED element exhibits enhanced emission properties and is highly applicable to fluid-based assembly technology, enabling high-quality image display with improved durability and efficiency in display apparatuses.
Implementation Method 1
an n-type semiconductor layer; an active layer being disposed on the n-type semiconductor layer; a p-type semiconductor layer being disposed on the active layer
Data Source
AI summary
There is provided a micro-LED device having high applicability to fluid-based assembly technology, which includes: an n-type semiconductor layer; an active layer disposed on the n-type semiconductor layer; a p-type semiconductor layer disposed on the active layer; an insulating layer surrounding at least the outer circumferential surface of the active layer; and a multilayer electrode part disposed at the outer circumferential surface of the insulating layer.