Micro LED Display Module Structure for Easier Sub-Pixel Replacement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The replacement of defective micro LEDs in display modules is challenging due to their small size, leading to increased repair costs and unit costs of products, as each micro LED corresponds to one sub-pixel and is difficult to replace.
Innovation Solution
A display module design where multiple micro LEDs are connected in a set with a thinner connection part, allowing them to be separated and independently replaced without requiring repair, using a manufacturing method that involves growing, connecting, and thermo-compressing light-emitting diodes on a substrate, enabling efficient production of large-area displays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If one micro LED corresponds to one sub-pixel, then the display achieves high resolution, but replacement of defective micro LEDs becomes difficult and repair cost increases
Solution Approach 1:
The patent divides a sub-pixel into multiple micro LEDs (e.g., three micro LEDs per sub-pixel) instead of using one micro LED per sub-pixel. This segmentation allows partial replacement of defective micro LEDs while maintaining display resolution, as not all micro LEDs need to be replaced to restore functionality.
Solution Approach 2:
The patent creates local differences in the display structure by having multiple micro LEDs per sub-pixel with different orientations and connection methods. This local quality variation enables selective replacement of defective micro LEDs without affecting the entire sub-pixel, reducing repair complexity.
2Measurement precision
If micro LED size is reduced to 100 μm or smaller, then display resolution increases, but replacement difficulty and repair cost increase
Solution Approach 1:
By segmenting each sub-pixel into multiple micro LEDs, the patent reduces the complexity of handling individual micro LEDs during replacement. Even though each micro LED remains small (100 μm or smaller), the segmented structure allows for more manageable replacement processes compared to replacing single-critical micro LEDs.
Solution Approach 2:
The patent introduces connection parts as intermediary elements that link multiple micro LEDs within a sub-pixel. These connection parts facilitate the replacement process by providing structured attachment points, making it easier to handle and replace small micro LEDs without direct manipulation of the tiny components themselves.
3Ease of repair
If multiple micro LEDs are connected in a set with thinner connection parts, then ease of replacement improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent optimizes the thickness parameter of connection parts to balance manufacturability and replaceability. By carefully controlling the thickness to be less than the micro LED thickness, the connection parts become easier to manipulate during replacement while remaining manufacturable using existing fabrication processes.
Solution Approach 2:
The patent uses connection parts with thickness that is partially sufficient (thinner than micro LEDs but not extremely thin), providing just enough structural integrity for manufacturing while enabling easier replacement. This partial action approach avoids the need for extremely precise manufacturing while achieving the replacement goal.
Data Source
AI summary
A set of light-emitting diodes may include: a first light-emitting diode may include a light-emitting surface and a pair of electrodes provided on an opposite surface of the light-emitting surface; and a second light-emitting diode may include a light-emitting surface and a pair of electrodes, the second light-emitting diode being connected to one side of the first light-emitting diode by a connection part. A thickness of the connection part may be less than a thickness of the first light-emitting diode and a thickness of the second light-emitting diode.