Micro-LED Chip Structure to Reduce Surface Recombination Loss
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Solution Overview
Problem
Existing micro-LED structures face challenges in optimizing the light emitting layer's configuration to enhance light emission efficiency and prevent surface recombination carrier loss.
Innovation Solution
The proposed micro-LED structure includes a first type conductive layer, a second type conductive layer stacked on the first, and a light emitting layer formed between them. The light emitting layer extends horizontally away from the edges of the conductive layers, ensuring no contact and thus minimizing surface recombination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the light emitting layer contacts the conductive layers at their edges, then the device complexity is reduced and manufacturing is simplified, but surface recombination occurs causing carrier loss and reduced light emission efficiency
Solution Approach 1:
The light emitting layer is configured to extend horizontally away from the edges of the conductive layers in a planar dimension, creating a stepped or offset arrangement. This dimensional change in the layer configuration prevents edge contact between the light emitting layer and conductive layers, thereby reducing surface recombination and carrier loss without adding vertical complexity to the device structure.
2Loss of energy
If the light emitting layer extends horizontally away from the conductive layer edges, then light emission efficiency is improved by reducing surface recombination, but the manufacturing precision requirements increase
Solution Approach 1:
The conductive layers are formed with predefined edge configurations and dimensional tolerances that accommodate the horizontal extension of the light emitting layer. By establishing the conductive layer geometry first with appropriate margins and offsets, the subsequent formation of the light emitting layer can achieve the required horizontal offset without requiring ultra-precise alignment, thus reducing manufacturing precision requirements while maintaining the anti-surface-recombination benefit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves light emission efficiency by reducing surface recombination carrier loss, leading to enhanced performance and reliability of the micro-LED.
Implementation Method 1
A micro-light emitting diode (micro-LED) is a device that emits light using an electric signal
Data Source
AI summary
A micro-LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer. The micro-LED chip further comprises: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer; and an isolation structure formed between adjacent micro-LEDs.