Micro-LED Display Panel Through-Hole Layout for Uniform Brightness

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Solution Overview

Problem

Micro-LED display panels face issues with uneven display due to differences in luminous efficiency of LED chips of different colors and unequal spacing from the driving end, leading to inconsistent light emission.

Innovation Solution

The display panel design includes a light-shielding layer with through-holes where LED chips are flipped to emit light, allowing light to pass through the transparent insulation layer and substrate with controlled intensity by adjusting the size of the through-holes, reducing light loss and enhancing uniformity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If LED chips of different colors are combined in one pixel, then the display can show full-color images, but differences in luminous efficiency cause uneven display

Engineering Contradiction:
Improvecolor display capabilityVSAvoiddisplay uniformity
Core Design Contradiction:
Adaptability or versatilityVSIllumination intensity

Solution Approach 1:

The invention divides the light emission control into individual components by providing separate through-holes for each LED chip. This allows independent adjustment of light transmission for red, green, and blue chips, enabling compensation for their different luminous efficiencies and achieving uniform display across all colors.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by making each through-hole's size specific to the corresponding LED chip's characteristics. Each through-hole is locally optimized with different dimensions to compensate for the specific luminous efficiency of each color's LED chip, creating non-uniform local properties that result in uniform overall display.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If LED chips are disposed at certain spaces on substrate, then the display panel can be manufactured, but unequal space between chips causes uneven display

Engineering Contradiction:
ImprovemanufacturabilityVSAvoiddisplay uniformity
Core Design Contradiction:
Ease of manufactureVSIllumination intensity

Solution Approach 1:

The invention compensates for unequal spacing between LED chips by locally adjusting the size of each through-hole. Chips with larger spacing receive larger through-holes to increase light transmission, while chips with smaller spacing receive smaller through-holes, thereby achieving uniform display despite manufacturing variations in chip positioning.

Inventive Principle:
Principle #3Local quality

3Ease of manufacture

If LED chips are at different distances from driving end, then the display panel can be manufactured, but differences in distance cause uneven display

Engineering Contradiction:
ImprovemanufacturabilityVSAvoiddisplay uniformity
Core Design Contradiction:
Ease of manufactureVSIllumination intensity

Solution Approach 1:

The patent addresses distance variations from the driving end by locally optimizing each through-hole's size based on its position. LED chips farther from the driving end are assigned larger through-holes to compensate for potential light loss, while closer chips have smaller through-holes, achieving uniform display across the panel despite manufacturing-induced position variations.

Inventive Principle:
Principle #3Local quality

4Ease of manufacture

If light-emitting surfaces of LED chips face towards substrate, then light can be emitted through substrate, but light loss occurs

Engineering Contradiction:
ImprovemanufacturabilityVSAvoidlight loss
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The invention changes the emission direction parameter of the LED chips from facing the substrate to facing away from the substrate (towards the light-shielding layer). This parameter change allows light to travel through optimized paths with fewer interfaces, reducing reflection and scattering losses while maintaining the ability to emit light through the substrate structure.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures controlled light emission intensity and reduced light loss, addressing the issue of uneven display by optimizing the placement and size of through-holes based on LED chip characteristics, resulting in improved display uniformity and contrast.

Implementation Method 1

Light emitted by light-emitting diode (LED) chips is emitted out of a substrate through a plurality of through-holes of a light-shielding layer

Methodology Applied
Scientific EffectLight emission from LED: Light Emitting Diode

Implementation Method 2

the transparent insulation layer includes a plurality of transparent portions arranged in the plurality of through-holes respectively

Methodology Applied
Scientific EffectLight transmission through transparent material: Refraction

Data Source

PatentUS20240404999A1Display panel, tiled display panel and manufacturing method of display panel
Publication Date: 2024.12.05 GUANGZHOU CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
  • US20240404999A1 patent drawing
  • US20240404999A1 patent drawing
  • US20240404999A1 patent drawing

AI summary

A display panel, a tiled display panel and a manufacturing method of display panel are provided. The display panel includes a substrate; a light-shielding layer disposed on the substrate and provided with a plurality of through-holes; a transparent insulation layer including transparent portions arranged in the through-holes respectively; a light-emitting layer disposed on the transparent insulation layer, wherein the light-emitting layer includes a plurality of light-emitting diode (LED) chips are disposed to the plurality of through-holes in a one-to-one correspondence, and a light-emitting surface the LED chip faces to the transparent portion; a device array layer disposed on the light-shielding layer and including a driver and a plurality of metal wirings used to connect the LED chips with the driver; and a sealing layer disposed on the substrate and encapsulating the light-shielding layer, the transparent insulation layer, the light-emitting layer, and the device array layer.