Micro LED Display Panel with Top Electrode Bonding via Connection Electrodes
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Solution Overview
Problem
The bonding process of micro light-emitting-diodes in micro LED display panels is complex and less reliable, making electrode bonding difficult.
Innovation Solution
A micro light-emitting-diode display panel design that includes a resin adhesive layer in a pixel groove with connection electrodes guiding the bottom electrode to the top, facilitating easier connection with electrode points, and a manufacturing method involving a transfer process using a transporting substrate and a receiving substrate with pre-formed electrode points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the micro light-emitting-diodes are bonded to the receiving substrate using pre-installed bonding material, then the micro LEDs can be transferred and assembled, but the bonding process becomes complex and less reliable
Solution Approach 1:
The invention applies preliminary action by pre-forming electrode points directly on the receiving substrate before transferring the micro LEDs. The receiving substrate is prepared with predetermined electrode points that match the electrode configuration of the micro LEDs, so that when the micro LEDs are transferred and placed onto the receiving substrate, the electrodes align with the corresponding electrode points without requiring complex bonding processes. This preliminary preparation of the receiving substrate simplifies the overall manufacturing process while ensuring reliable electrical connection.
2Productivity
If the micro light-emitting-diodes are transferred using laser lift-off technology, then the micro LEDs can be separated from the original substrate, but the electrode alignment and bonding difficulty increases
Solution Approach 1:
The invention uses the receiving substrate itself as an intermediary element that facilitates the transfer process. The receiving substrate is designed with electrode points that serve as both the target for transfer and the bonding interface. When micro LEDs are transferred via laser lift-off technology, they are directly placed onto the electrode points of the receiving substrate, which automatically aligns the electrodes and provides the bonding interface, eliminating the need for separate complex bonding steps.
3Reliability
If the bonding material undergoes solid-liquid-solid transformation, then the bonding can be achieved, but the process becomes difficult and time-consuming
Solution Approach 1:
The invention extracts the bonding material step from the overall process by incorporating the bonding function directly into the receiving substrate through pre-formed electrode points. Instead of using separate bonding material that requires solid-liquid-solid transformation, the electrode points on the receiving substrate serve as both the electrical connection points and the bonding interface. This extraction of the bonding function simplifies the process to direct placement and bonding, eliminating the time-consuming phase transformation steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies and enhances the reliability of electrode bonding by positioning the electrodes for easier connection and using a resin adhesive layer to secure the micro light-emitting-diodes, reducing bonding difficulties and improving reliability.
Implementation Method 1
the micro light-emitting-diodes are lifted from the original substrate by a laser lift-off (LLO) technology
Implementation Method 2
a resin adhesive layer disposed in the pixel groove, a micro light-emitting-diode embedded in the resin adhesive layer
Data Source
Figure 1~2
Figure 3~5
Figure 6~8
AI summary
Provided are a micro light emitting diode display panel and a manufacturing method therefor. For the micro light emitting diode display panel, a pixel groove (15) is filled with a resin bonding layer (13), a micro light emitting diode (200) is pressed and fixed into the resin bonding layer (13), and in addition, an electrode at the bottom of the micro light emitting diode (200) is guided to the top of the micro light emitting diode (200) by means of a connection electrode (6) to position two electrodes (71, 72) of the micro light emitting diode (200) at the top so that the electrodes (71, 72) of the micro light emitting diode (200) are conveniently connected to electrode contacts (43, 44), such that for the electrodes (71, 72) of the micro light emitting diode (200), the bonding difficulty can be reduced and the bonding reliability can be improved.