Micro LED Transfer via Metallic Adhesive Phase Change
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Solution Overview
Problem
The existing methods for transferring micro light-emitting diodes are prone to transfer failures due to strict requirements for the gap between transfer heads and the diodes, leading to defective display panels.
Innovation Solution
An apparatus comprising a main body with a spraying module for applying metallic adhesive liquid, a cooling module to cure the adhesive, and a heating module to melt it, allowing for precise bonding and separation of micro light-emitting diodes from the transfer heads, reducing the complexity and improving the efficiency of the transfer process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrostatic force is used to absorb micro light-emitting diodes for transfer, then transfer can be accomplished, but strict requirement for gap between transfer heads and diodes causes transfer failure
Solution Approach 1:
The patent replaces the electrostatic absorption mechanism with a thermal field-based transfer mechanism. The transfer head uses localized heating to melt adhesive material, creating a liquid adhesive layer that bonds the micro LED to the transfer head through capillary action and surface tension, eliminating the need for precise electrostatic gap control
Solution Approach 2:
The patent changes the physical state of the adhesive material from solid to liquid through temperature control. During transfer, the adhesive is heated to melting point to become liquid for bonding, then cooled to solidify for secure attachment, enabling reliable transfer without strict gap requirements
2Reliability
If electrostatic method is used for transferring micro light-emitting diodes, then transfer can be achieved, but the process complexity increases due to strict gap requirements
Solution Approach 1:
The patent substitutes the complex electrostatic control system with a simpler thermal processing system. The transfer head incorporates heating elements that locally melt adhesive material, and cooling elements that solidify it, replacing the need for precise electrostatic field control and gap maintenance
Solution Approach 2:
The patent introduces adhesive material as an intermediary substance between the transfer head and micro LED. This adhesive mediator enables bonding through thermal processing, eliminating the need for direct electrostatic interaction and simplifying the transfer mechanism
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach lowers the difficulty and enhances the efficiency of micro light-emitting diode transfer, reducing the likelihood of transfer failures and resulting in higher quality display panels by using metallic adhesive liquid that is cured and then melted for separation, unlike electrostatic methods which require precise gap control.
Implementation Method 1
a spraying module (20), applied for spraying metallic adhesive liquid onto the micro light-emitting diodes (100)
Implementation Method 2
a cooling module (30), applied for cooling the metallic adhesive liquid on the wait-to-transfer micro light-emitting diodes (100), so as to cure the metallic adhesive liquid
Implementation Method 3
Each neighboring pair of the transfer heads (101) are disposed with a gas-blowing hole (103) on therebetween, said cooling module blows gas outwardly via the gas-blowing holes (103)
Implementation Method 4
a heating module (40), applied for heating the cured metallic adhesive liquid, so as to melt the metallic adhesive liquid
Implementation Method 5
Each of the transfer heads (101) is disposed with a resistance heating body (104), said heating module conducts the electricity to the resistance heating body (104)
Data Source
AI summary
The present invention provides an apparatus and a method for transferring micro light-emitting diodes. Said apparatus for transferring the micro light-emitting diodes comprises a main body, and a spraying module, a cooling module and a heating module disposed on said main body. The spraying module sprays metallic adhesive liquid onto the micro light-emitting diodes that wait to transfer, the cooling module cools the metallic adhesive liquid on the wait-to-transfer micro light-emitting diodes, thereby curing the metallic adhesive liquid to adhesively bond the main body with the wait-to-transfer micro light-emitting diodes together implementing the transfer of the micro light-emitting diodes, After transferred to reach the position, the cured metallic adhesive liquid is heated by the heating module, thereby melting the metallic adhesive liquid to separate the main body from the wait-to-transfer micro light-emitting diodes. This is capable of lowering the difficulty of transferring the micro light-emitting diodes, and enhancing the efficiently of transferring the micro light-emitting diodes.