Micro LED Insulation Structure to Prevent Transfer Cracking
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Solution Overview
Problem
Conventional micro LED manufacturing processes face challenges in ensuring the reliability and protection of LED chips during the transfer process, particularly due to issues with insulation layer bonding and potential cracking, which can lead to leakage and reduced illumination efficiency.
Innovation Solution
A light-emitting element design featuring a first and second insulation layer covering the semiconductor surface of the LED chip, with protrusion portions on the sidewalls to enhance bonding reliability and prevent cracking, along with a method of alternating processes for flipping and coating to ensure comprehensive coverage and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulation layer is disposed to cover micro LED as a protection layer, then the reliability of manufacture is enhanced, but the insulation layer may crack during transfer process leading to leakage
Solution Approach 1:
The insulation structure is divided into multiple segments: a first insulation layer covering the first surface and part of sidewalls, and a second insulation layer covering the second surface and remaining sidewalls. This segmentation allows each layer to independently provide protection without the stress concentration that causes cracking in a single continuous layer.
Solution Approach 2:
The insulation protection transitions from a single-layer planar structure to a multi-layer three-dimensional structure with protrusion portions extending laterally from the sidewalls. This dimensional enhancement provides overlapping coverage that prevents cracking propagation and eliminates leakage paths.
2Device complexity
If a single insulation layer is used to cover the LED chip, then the structure is simple, but the coverage is insufficient and cracking occurs
Solution Approach 1:
The insulation system is segmented into two distinct layers with different coverage areas. The first insulation layer covers the first surface and first part of sidewalls, while the second insulation layer covers the second surface and second part of sidewalls, achieving complete coverage through systematic division.
Solution Approach 2:
Different regions of the LED chip receive differentiated insulation coverage. The protrusion portions of the second insulation layer specifically extend to cover areas adjacent to the first insulation layer, providing localized reinforcement at critical stress points while maintaining overall structural efficiency.
3Ease of manufacture
If the insulation layer covers only part of the sidewalls, then the manufacturing process is easier, but leakage occurs at uncovered areas
Solution Approach 1:
The second insulation layer incorporates protrusion portions that extend laterally from the sidewalls, creating a three-dimensional overlapping coverage structure. This dimensional approach ensures that areas adjacent to the first insulation layer are also protected, eliminating leakage paths without significantly complicating the manufacturing process.
Solution Approach 2:
The protrusion portions of the second insulation layer act as intermediary protective elements that bridge the coverage gap between the first and second insulation layers. These protrusions provide continuous insulation coverage at the interface region, preventing leakage while maintaining manufacturing feasibility.
Data Source
AI summary
A light-emitting element includes light-emitting diode (LED) chip with a first and second surface opposite to each other, and sidewalls connecting the first and second surface. The light-emitting element further includes a first insulation layer disposed on and covering the first surface and one part of the sidewalls. The light-emitting element further includes multiple connection pads physically contact the first surface and protruding from the first insulation layer, as well as a second insulation layer disposed on and covering the second surface and the other part of the sidewalls. The second insulation layer includes a cover portion and protrusion portions. The cover portion covers the whole second surface and the other part of the sidewalls. The protrusion portions are disposed on the sidewalls, protrude from the cover portion and extend laterally.