Micro LED Transfer Substrate with Dynamic Base Spacing
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Solution Overview
Problem
Conventional Micro LED transfer processes lack precision, resulting in large distances between transferred LEDs, which fails to meet the high precision requirements for Micro LED display panel manufacturing.
Innovation Solution
A chip transfer substrate with distance adjusting components, comprising electrification structures that can extend and contract to adjust the distance between bases, allowing for precise control of LED placement, utilizing triboelectric effects to generate charges for electrostatic adsorption and transfer of Micro LEDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional transfer processes are used, then the transfer process is simple, but the transfer precision is low resulting in large distances between transferred LEDs
Solution Approach 1:
The patent employs movable bases that can dynamically adjust their positions on the substrate through distance adjusting components. This dynamic positioning capability allows the system to achieve high transfer precision by precisely controlling the location of each base carrying Micro LEDs, while the movement mechanism maintains reasonable process simplicity through mechanical sliding along guide structures.
Solution Approach 2:
The distance adjusting components modify the spatial parameters of the system by changing the distances between adjacent bases. By adjusting these parameters, the system can achieve precise control over LED placement spacing, transforming the fixed-parameter conventional process into a variable-parameter precision process that meets high manufacturing requirements.
2Manufacturing precision
If distance between bases is reduced for high precision, then transfer accuracy improves, but manufacturing complexity increases
Solution Approach 1:
The patent divides the transfer substrate into multiple independent movable bases, each capable of individual position adjustment. This segmentation allows precise control of each LED placement location without requiring complex adjustment of the entire system, thereby maintaining manufacturing ease while achieving high placement accuracy through localized adjustments.
Solution Approach 2:
The distance adjusting components serve as intermediary mechanisms between the bases and the substrate. These intermediaries simplify the manufacturing process by providing a straightforward mechanical adjustment interface, making it easier to control base positions and achieve precise LED placement without complex direct coupling mechanisms.
3Manufacturing precision
If movable bases are used to adjust distance, then transfer precision is enhanced, but device structure becomes more complex
Solution Approach 1:
The movable bases are nested on the substrate in a structured arrangement, with each base containing integrated distance adjusting components. This nesting approach consolidates multiple functions into compact units, enhancing transfer precision through precise positioning while minimizing overall structural complexity by avoiding separate distributed components.
Solution Approach 2:
The patent employs flexible or thin-film structures in the base design that allow for easy movement and positioning adjustments. These flexible components simplify the overall device structure by eliminating the need for complex rigid mechanical linkages, thereby achieving high transfer accuracy through simple, elegant structural designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the accuracy of Micro LED transfer, reducing manufacturing complexity and costs by allowing for high-precision placement and efficient transfer of Micro LEDs, improving the overall quality of Micro LED display panels.
Implementation Method 1
the first and second electrification structures are deformed and brought into contact with each other by an external force, and surfaces of the first and second electrification structures facing each other generate charges of opposite polarities when brought into contact with each other
Data Source
AI summary
The present disclosure provides a chip transfer substrate, a chip transfer device and a chip transfer method. The chip transfer substrate includes a substrate, a plurality of bases spaced apart from each other on the substrate, the plurality of bases being configured to carry micro light emitting diodes (Micro LEDs) to be transferred and being movable on the substrate; and a plurality of distance adjusting components each arranged between two adjacent bases and configured to adjust a distance between the two adjacent bases.