Micro LED Transfer Equipment with Adjustable Side Arms
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Solution Overview
Problem
Current technologies face challenges in rapidly and efficiently transferring micro LEDs from a wafer to another substrate while maintaining precise alignment and mass productivity, as seen in the semiconductor manufacturing process.
Innovation Solution
The micro device transfer equipment employs a convey platform and transfer device with adjustable side arms to clamp and relocate micro LEDs, utilizing a convey platform to move the wafer and transfer device in coordinated stages to achieve efficient mass transfer of micro LEDs, ensuring accurate positioning and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional LED arrays are used with millimeter dimensions, then manufacturing is easier, but the resolution and brightness are insufficient for high-quality displays
Solution Approach 1:
The invention segments the micro LED wafer into individual transferable units by using multiple transfer heads that can independently pick up and place micro LEDs. The wafer is divided into multiple columns and rows, with each transfer head responsible for specific columns, enabling parallel processing and maintaining high productivity despite the miniaturization to micrometer dimensions
Solution Approach 2:
The invention introduces a new dimension of operation by using multiple transfer heads arranged in parallel, operating simultaneously on different columns of the wafer. This multi-dimensional approach allows mass transfer of micro LEDs at micrometer scale without sacrificing productivity, as multiple transfer operations occur concurrently across different spatial dimensions
2Productivity
If multiple transfer heads are used to increase transfer speed, then productivity improves, but the device complexity increases
Solution Approach 1:
Each transfer head is designed as a universal module capable of performing multiple functions: approaching the wafer, picking up micro LEDs, retracting, and placing devices on the substrate. The transfer heads can operate independently yet cooperatively, with each head handling specific columns of the wafer. This modular universal design increases productivity through parallel operation while managing complexity by standardizing the transfer head structure
Solution Approach 2:
The transfer device employs dynamic control where transfer heads can independently adjust their positions, approach speeds, and operational timing. The system dynamically coordinates multiple transfer heads to operate in sequence or parallel based on the wafer configuration and transfer requirements, optimizing productivity while managing device complexity through adaptive control
3Manufacturing precision
If the transfer head approaches the wafer too closely to pick up micro LEDs, then transfer precision improves, but the risk of damaging the micro LEDs increases
Solution Approach 1:
The transfer head performs preliminary actions by approaching the wafer to a predetermined safe distance before actual pickup. The approach path is pre-calculated and controlled to ensure the pickup element only contacts the micro LED at the exact moment of transfer. This preliminary positioning ensures precise alignment while preventing premature contact that could damage the fragile micro LEDs
Solution Approach 2:
The invention uses a pickup element as an intermediary between the transfer head and the micro LED. This intermediary component facilitates the transfer process by making controlled contact with the micro LED for pickup and placement, while the transfer head itself remains at a safe distance. The intermediary pickup element protects the micro LED from direct contact with the main transfer head structure, ensuring both precision and integrity
Data Source
Figure 1A
Figure 1B
Figure 2A
AI summary
A micro device transfer equipment includes a convey platform and a transfer device. The convey platform is configured to carry a wafer and move the wafer towards a specific direction, wherein a plurality of micro devices are fabricated on the wafer. The transfer device includes a plurality of transfer heads each including a base arm, a first side arm and a second side arm. The first side arm and the second side arm are disposed on the base arm in a movable manner for clamping a corresponding micro device among the plurality of micro devices.