Micro LED Transfer Layout Using Pneumatic Pressure and Adhesive Protrusions
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Solution Overview
Problem
Current display technologies face challenges in accurately transferring and arranging large numbers of semiconductor light emitting elements during the manufacturing process, leading to arrangement errors and increased manufacturing time for display devices.
Innovation Solution
A method involving the use of pneumatic pressure to transfer semiconductor light emitting elements from one substrate to another, utilizing a flexible adhesive material and an organic stamp layer to minimize arrangement errors and increase the size of the transfer substrate, thereby reducing the number of transfer operations and manufacturing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional transfer methods are used to transfer semiconductor light emitting elements, then the transfer process can be completed, but arrangement errors occur and manufacturing time increases
Solution Approach 1:
The patent applies pneumatic pressure control to transfer semiconductor light emitting elements from a first substrate to a second substrate. By controlling pneumatic pressure, the elements are pressed and transferred accurately, minimizing arrangement errors while maintaining efficient manufacturing speed. The pneumatic system enables precise control over the transfer process without requiring manual intervention for each element.
Solution Approach 2:
The patent introduces a second substrate as an intermediary transfer medium between the growth substrate and the final display panel. This intermediary substrate facilitates accurate positioning and transfer of multiple semiconductor light emitting elements simultaneously, reducing arrangement errors and enabling more efficient transfer operations compared to direct transfer methods.
2Productivity
If the transfer substrate size is increased to reduce transfer operations, then manufacturing time is reduced, but arrangement accuracy may deteriorate
Solution Approach 1:
The pneumatic pressure control system maintains arrangement precision even when transferring elements across larger substrate areas. The controlled pressure ensures that elements are pressed and positioned accurately regardless of the increased substrate size, allowing the use of larger transfer substrates to reduce the number of transfer operations while maintaining high precision.
Solution Approach 2:
The transfer process is segmented into controlled stages: alignment, pneumatic pressing, and transfer. This segmentation allows the system to maintain precision across larger substrate areas by breaking down the transfer operation into manageable, controlled steps that can be applied uniformly across the entire substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively minimizes arrangement errors and allows for the transfer of semiconductor light emitting elements to a larger substrate, reducing the number of transfer operations and shortening the manufacturing time for display devices.
Implementation Method 1
finally pressing the semiconductor light emitting element on the first substrate onto the second substrate using pressure applied to the second substrate, which is generated according to a change in pneumatic pressure
Implementation Method 2
provisionally pressing the semiconductor light emitting element on the first substrate onto the second substrate
Data Source
AI summary
Discussed is a manufacturing method of a display apparatus, and the display apparatus. The display includes a substrate, an adhesive layer located on the substrate and including protruding portions, semiconductor light-emitting diodes located on the adhesive layer, an insulating layer located on the semiconductor light-emitting diodes and the adhesive layer, and wiring electrodes electrically connected to the semiconductor light-emitting diodes, wherein the protruding portions of the adhesive layer are positioned at regular intervals to correspond to the shapes of the contact surfaces of the semiconductor light-emitting diodes in contact with the adhesive layer.