Micro LED Transfer Structure for Accurate Panel Positioning
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Solution Overview
Problem
The manufacturing process of micro LED displays faces challenges in accurately positioning and reducing damage to micro LEDs during the transfer from a wafer to a panel, leading to inefficiencies and inaccuracies in the assembly process.
Innovation Solution
The proposed solution involves a micro LED display device with a micro light emitting unit, conductive structure, and substrate configuration, where the micro light emitting unit includes semiconductor and electrode structures with insulation and conductive layers, and a manufacturing method that disposes the conductive structure on the micro light emitting elements before transfer, using an isolation layer to prevent direct contact with the substrate and reduce damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If micro LED is transferred from a wafer to a panel, then the micro LED display can be manufactured, but the micro LED may fall or cannot be positioned accurately on the panel
Solution Approach 1:
The patent introduces a conductive structure as an intermediary component between the micro LED and the substrate. This conductive structure includes a conductive layer and an isolation layer that work together to facilitate accurate positioning while preventing direct contact that could cause damage. The conductive structure acts as a mediator that resolves the contradiction between positioning accuracy and damage prevention.
Solution Approach 2:
The conductive structure is disposed on the micro light emitting elements before the substrate disposing step. This preliminary action ensures that the positioning framework is already in place prior to transfer, enabling accurate positioning while the isolation layer is pre-configured to prevent damage during the subsequent substrate contact.
2Ease of manufacture
If the micro light emitting unit is disposed directly on the substrate, then the manufacturing process is simplified, but the micro LED cannot be positioned accurately and may be damaged
Solution Approach 1:
The conductive structure serves as an intermediary layer between the micro light emitting unit and the substrate. While this adds a step to the manufacturing process, it enables accurate positioning through the conductive layer and prevents damage through the isolation layer, thereby resolving the contradiction between manufacturing simplicity and positioning accuracy.
3Ease of manufacture
If the micro light emitting unit is disposed directly on the substrate, then the manufacturing process is simplified, but the micro LED may be damaged during transfer
Solution Approach 1:
The isolation layer within the conductive structure provides beforehand cushioning by preventing direct contact between the micro LED and the substrate. This protective measure is built into the structure prior to transfer, cushioning against potential damage during the manufacturing process while maintaining relative simplicity.
Solution Approach 2:
The conductive structure acts as a mediator that protects the micro LED during transfer. The isolation layer specifically serves as a protective intermediary that prevents direct contact and potential damage, resolving the contradiction between manufacturing simplicity and damage prevention.
Data Source
AI summary
A micro LED display device includes a micro light emitting unit, a conductive structure and a substrate. The micro light emitting unit includes a plurality of micro light emitting elements, and each of the micro light emitting elements includes a semiconductor structure and an electrode structure. The semiconductor structure includes a first type semiconductor layer, a light emitting layer and a second type semiconductor layer. The electrode structure includes a first type electrode and a second type electrode. The conductive structure includes a first type conductive layer and a second type conductive layer. The first type conductive layer is electrically connected to the first type electrode, and the second type conductive layer is electrically connected to the second type electrode. The micro light emitting unit is disposed on the substrate, and the electrode structure is disposed toward the substrate and includes a gap therebetween.