Micro LED Unit Pixel Structure for Reliable Batch Mounting
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Solution Overview
Problem
The challenge lies in handling and mounting micro LEDs, which are extremely small, making it difficult to directly integrate them into display panels effectively.
Innovation Solution
The proposed solution involves a unit pixel design that includes a transparent substrate, multiple micro LEDs arranged on the substrate, an adhesive layer for bonding, a step adjusting layer with a concave-convex pattern, and connection layers electrically connected to the micro LEDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If micro LEDs are made extremely small to increase display resolution, then display quality is improved, but handling and mounting difficulty increases
Solution Approach 1:
The patent segments the micro LED manufacturing process into two distinct stages: first, mass-producing micro LEDs on a separate substrate where they can be handled easily; second, transferring them to the display panel in batches. This segmentation allows high precision manufacturing without requiring direct manual handling of individual micro LEDs during assembly.
Solution Approach 2:
The patent introduces an intermediary substrate as a temporary platform for growing and handling micro LEDs. This intermediary substrate acts as a mediator between the manufacturing process and the final display panel, enabling easy handling during production while achieving precise placement on the target panel through automated transfer processes.
2Manufacturing precision
If a large number of micro LEDs are arranged on a single substrate, then display resolution is improved, but the complexity of direct mounting increases
Solution Approach 1:
The patent divides the mounting process into separate stages: micro LEDs are first arranged and tested on an intermediary substrate in manageable batches, then transferred to the display panel. This segmentation reduces the complexity of handling all micro LEDs simultaneously on a single substrate.
Solution Approach 2:
The patent performs preliminary actions by pre-arranging and pre-testing micro LEDs on an intermediary substrate before final mounting on the display panel. This preliminary organization simplifies the subsequent transfer process and reduces the overall complexity of the mounting operation.
3Device complexity
If micro LEDs are directly mounted on display panel, then integration is simplified, but reliability decreases due to handling difficulties
Solution Approach 1:
The patent introduces an intermediary substrate as a mediator that enables reliable micro LED attachment before final transfer to the display panel. This intermediary platform provides a stable environment for bonding and testing, ensuring higher reliability that would be difficult to achieve through direct mounting on the final panel.
Solution Approach 2:
The patent applies beforehand cushioning by performing bonding and reliability testing on the intermediary substrate before the critical transfer to the display panel. This preliminary bonding process cushions against potential failures during the final mounting, ensuring higher overall reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability of the unit pixels and prevents failed micro LEDs from being mounted, thereby improving the overall performance and efficiency of the displaying apparatus.
Implementation Method 1
an adhesive layer bonding the light emitting devices to the transparent substrate
Data Source
AI summary
A display apparatus including a panel substrate and a pixel module disposed thereon, in which the pixel module includes a circuit board and light emitters arranged and aligned in a first direction and disposed on the circuit board, in which each light emitter includes a light emitting layer including a first and a second conductivity type semiconductor layer, and an active layer interposed therebetween, a first and a second connection layer electrically connected to the first and the second conductivity type semiconductor layer, respectively, and a step adjustment layer disposed between the circuit board and the light emitting layer and covering a region of the light emitting layer and including an opening region configured to provide an electrical contact region between the first connection layer and the first conductivity type semiconductor layer.