Micro LED Encapsulation with UV Resin Microlenses
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Solution Overview
Problem
Existing micro LED display manufacturing processes lack an effective encapsulation method to protect micro LEDs and drive substrates while enhancing light emission efficiency.
Innovation Solution
A micro LED array substrate encapsulation structure featuring a base plate with a micro LED array and a photoresist protection layer containing ultraviolet (UV) resin microlenses, where the UV resin microlenses are formed in a bulged shape to cover the micro LEDs, providing protection and adjusting optical paths for improved light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If micro LEDs are transferred to a receiving substrate using NTP, then a micro LED array substrate is formed, but the micro LEDs and drive substrate lack protection and light emission efficiency is not enhanced
Solution Approach 1:
The encapsulation structure is segmented into multiple functional layers: a photoresist protection layer with via holes for mechanical protection, and a separate UV resin microlens layer for optical enhancement. This segmentation allows each layer to perform its specific function independently, providing comprehensive protection and light emission enhancement without excessive overall complexity.
Solution Approach 2:
The encapsulation structure uses composite materials combining photoresist (for protection and via formation) and UV resin (for microlens formation and optical enhancement). This composite approach integrates protective and optical functions in a unified structure, resolving the contradiction between protection and light emission enhancement.
2Reliability
If a photoresist protection layer with via holes is formed, then micro LEDs are protected, but light emission efficiency is not enhanced
Solution Approach 1:
The patent merges the protective photoresist layer with the optical enhancement UV resin layer into a single encapsulation structure. The UV resin is filled into the via holes of the photoresist layer, combining mechanical protection and optical enhancement functions in one integrated structure, thereby simultaneously improving reliability and illumination intensity.
Solution Approach 2:
UV resin microlenses with curved (bulged) surfaces are formed within the via holes. The spherical/curved shape of the microlenses optimizes light emission by focusing and directing light rays, thereby enhancing light emission efficiency while maintaining the protective function of the underlying photoresist layer.
3Illumination intensity
If UV resin microlenses are formed in via holes, then light emission efficiency is enhanced, but manufacturing complexity increases
Solution Approach 1:
The photoresist protection layer with via holes is formed first as a preliminary structure. This preliminary action creates ready-made cavities that guide the subsequent UV resin filling process, making the formation of microlenses more straightforward and reducing overall manufacturing complexity despite the multiple steps involved.
Solution Approach 2:
The photoresist protection layer acts as an intermediary structure that facilitates the formation of UV resin microlenses. By providing pre-formed via holes as templates, the photoresist layer simplifies the UV resin deposition process and enables precise microlens positioning, thereby reducing manufacturing complexity.
4Illumination intensity
If transparent materials are used for photoresist and UV resin, then light emission is improved, but material selection constraints increase
Solution Approach 1:
Different regions of the encapsulation structure use materials with different properties optimized for their specific functions: the photoresist layer uses transparent materials for light transmission, while the UV resin layer uses materials with specific refractive indices for optical enhancement. This local optimization of material properties improves light emission while managing material selection constraints through functional differentiation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The encapsulation structure effectively protects micro LEDs and drive substrates while enhancing light emission efficiency by using transparent, hydrophobic/hydrophilic materials and allowing for pre-designed light distribution through adjustable UV resin microlenses.
Implementation Method 1
each of the vias is filled therein with an ultraviolet (UV) resin microlens that has an upper surface made in a bulged form; each of the UV resin microlenses covers the micro LED received in a corresponding one of the vias
Implementation Method 2
A material of the photoresist protection layer and a material of the UV resin microlenses are respectively and selectively a hydrophobic material and hydrophilic material
Implementation Method 3
A material of the photoresist protection layer and a material of the UV resin microlenses are respectively and selectively a hydrophobic material and hydrophilic material
Implementation Method 4
each of the vias is filled therein with an ultraviolet (UV) resin microlens
Data Source
AI summary
The present invention provides a micro LED array substrate encapsulation structure and an encapsulation method thereof. The micro LED array substrate encapsulation structure of the present invention includes a base plate, a micro LED array, and a photoresist protection layer. The micro LED array includes a plurality of micro LEDs arranged in an array. The photoresist protection layer is formed with a plurality of vias at locations corresponding to the plurality of micro LEDs. The plurality of micro LEDs are respectively located in the plurality of vias. Each of the vias is filled therein with a UV resin microlens that has an upper surface in a bulging form and covers the micro LED in the corresponding one of the vias. The micro LEDs and driving substrates located thereunder can be protected and an effect of light emission of the micro LED array substrate can be improved.