Micro-LED Display Panel Via Hole Integration
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Solution Overview
Problem
The mass transfer technology for micro LED displays is complex, inefficient, and costly, with challenges in alignment accuracy and electrical connections between driving circuits and micro-LED elements.
Innovation Solution
A display panel design where the LED element layer is disposed on the side of the driving circuit layer facing away from the substrate, with micro-LED elements electrically connected to driving circuits through via holes, eliminating the need for a bonding layer and transfer process, thereby improving alignment accuracy and preparation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mass transfer technology is used to transfer LED chip particles from original substrate to substrate with driving circuits, then micro-LED display can be achieved, but the process becomes complex and efficiency decreases
Solution Approach 1:
The patent merges the LED element layer formation and driving circuit layer formation into a single integrated process. Both layers are formed on the same substrate simultaneously, eliminating the need for separate mass transfer operations. This integration directly reduces process complexity while maintaining alignment accuracy through the via hole connection method.
Solution Approach 2:
Instead of transferring LED chips to a pre-formed driving circuit substrate, the patent inverts the approach by forming both layers on the same substrate. The driving circuits are formed after the LED element layer, and electrical connections are established through via holes penetrating the driving circuit layer, reversing the conventional transfer sequence.
2Manufacturing precision
If mass transfer technology is used to transfer LED chip particles, then micro-LED display can be achieved, but manufacturing efficiency is low and cost increases
Solution Approach 1:
The patent performs preliminary actions by forming the LED element layer first on the substrate, then forming the driving circuit layer with integrated via holes that directly connect to the LED elements. This preliminary positioning eliminates the need for subsequent transfer operations and bonding processes, improving both connection accuracy and preparation efficiency.
Solution Approach 2:
The patent extracts the mass transfer and bonding processes from the manufacturing flow entirely. By forming both layers on the same substrate with direct via hole connections, the complex transfer head operations, alignment procedures, and bonding steps are completely removed, streamlining the manufacturing process.
3Manufacturing precision
If bonding layer and transfer process are eliminated, then alignment accuracy and electrical connection accuracy are improved, but alternative connection method must be implemented
Solution Approach 1:
The patent transitions from planar bonding connections to three-dimensional via hole connections. Electrical connections are established by forming conductive pathways through the thickness of the driving circuit layer, connecting the LED element layer to the driving circuits in a vertical dimension, thereby eliminating the need for intermediate bonding layers.
Data Source
AI summary
Provided are a display panel, a preparation method thereof and a display device. The display panel includes a substrate; a driving circuit layer, where the driving circuit layer is disposed on a side of the substrate, and includes a plurality of driving circuits; and an LED element layer, where the LED element layer is disposed on a side of the driving circuit layer facing away from the substrate, and includes a plurality of micro-LED elements, where each of the plurality of micro-LED elements is electrically connected to a respective one of the plurality of driving circuits through a via hole.